Porous Metal Submount Connection for Cooler Semiconductor Lasers
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Solution Overview
Problem
High-power semiconductor laser light-emitting devices face challenges in efficiently conducting heat generated by the semiconductor laser to the mounting base and reducing interference between the laser beam and surrounding components, leading to reduced output and reliability.
Innovation Solution
A semiconductor laser light-emitting device is designed with a porous metal connecting member that covers the submount and mounting base, featuring a peripheral portion that continuously covers the submount's front face and the mounting base's surface, allowing efficient heat conduction and minimizing laser beam interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If current flowing through the semiconductor laser is increased to increase output, then the output of the semiconductor laser light-emitting device is improved, but the heat generated at the semiconductor laser increases and the temperature of the semiconductor laser increases, which reduces the output of the laser beam and the reliability of the semiconductor laser
Solution Approach 1:
The connecting member is divided into a central portion and a peripheral portion, with each serving distinct functions. The central portion focuses on heat conduction from the semiconductor laser, while the peripheral portion covers the front face of the submount to conduct heat from the laser beam path and reduce interference. This segmentation allows simultaneous optimization of heat dissipation and beam quality without increasing overall device temperature.
Solution Approach 2:
Different regions of the connecting member are designed with different characteristics. The central portion directly under the semiconductor laser is optimized for maximum heat conduction, while the peripheral portion extending to the front face is optimized for reducing laser beam interference and conducting heat from the beam path. This local differentiation enables the system to handle high current while maintaining beam quality and reducing overall temperature rise.
2Power
If a plurality of semiconductor lasers are used to increase output, then the total output is improved, but the amount of heat generated increases and the temperature increases, reducing reliability
Solution Approach 1:
The connecting member's peripheral portion extending to the front face of the submount provides additional heat conduction paths that distribute heat from multiple laser sources more effectively. This segmentation of heat conduction paths allows the system to handle higher total power from multiple lasers while maintaining individual laser temperatures within reliable operating ranges.
3Temperature
If the connecting member covers more area to improve heat conduction, then heat dissipation is improved, but the interference between the laser beam and components around the semiconductor laser increases
Solution Approach 1:
The connecting member is segmented into central and peripheral portions with distinct functions. The peripheral portion extends to cover the front face of the submount, providing additional heat conduction area without significantly interfering with the laser beam path. This segmentation enables the system to achieve both improved heat dissipation and reduced beam interference by strategically positioning different functional regions.
Solution Approach 2:
The peripheral portion of the connecting member is specifically designed to cover the front face area where laser beam interference occurs. This local placement provides heat conduction benefits in the beam path region while minimizing overall interference with the laser beam, as the coverage is concentrated in the critical front face area rather than extending broadly across the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal resistance and enhances heat dissipation, improving the semiconductor laser's output and reliability by efficiently conducting heat and reducing laser beam interference.
Implementation Method 1
efficiently conducting heat generated at the semiconductor laser to the mounting base via the submount
Data Source
AI summary
A semiconductor laser light-emitting device includes: a mounting base (mounting substrate); a submount disposed above the mounting base; a connecting member that connects the mounting base and the submount and is composed of a porous metal material; and a semiconductor laser disposed above the submount. The submount includes a front face that is a face on the light emission side of the semiconductor laser. The connecting member includes a peripheral portion that continuously covers at least part of the front face of the submount and the peripheral area of a first area of the top surface of the mounting base, where the first area corresponds to the submount. The top surface of the peripheral portion is straight or recessed at a cross section that intersects the front face of the submount and the top surface of the mounting base.