Porous Substrate Venting for Void-Free Underfill Assembly
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Solution Overview
Problem
Conventional semiconductor device packaging methods introduce voids and back contamination due to trapped gaseous material during underfill processes, leading to structural vulnerabilities and connectivity issues.
Innovation Solution
Incorporating a substrate with a solid portion and a porous portion, where the porous portion allows gaseous material to escape while preventing underfill material from passing through, thereby reducing voids and back contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods are used with solid substrate, then underfill material is retained, but gaseous material becomes trapped causing voids and back contamination
Solution Approach 1:
The substrate incorporates a porous portion with controlled porosity that allows gaseous material to pass through during underfill processes while preventing underfill material from passing through, thereby eliminating voids and back contamination without compromising structural integrity
Solution Approach 2:
The porous portion acts as an intermediary structure between the solid substrate and the external environment, selectively mediating the passage of gaseous material while blocking underfill material through its controlled pore structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively eliminates voids and back contamination, enhancing the structural integrity and connectivity of semiconductor devices by allowing gaseous material to escape during underfill processes without affecting the underfill material's retention.
Implementation Method 1
the porous portion allows gaseous material to escape while preventing underfill material from passing through
Data Source
AI summary
This document discloses techniques, apparatuses, and systems for a semiconductor device with a porous air vent. The semiconductor device includes a semiconductor die mounted to a substrate at one or more contact pads. Underfill material is disposed between the semiconductor die and the substrate. The substrate includes a porous portion composed of a porous material. The porous material is such that air, but not the underfill material, may pass from an area between the semiconductor die and the substrate to an area below the substrate. As a result, air may pass through the porous portion during the underfill process and the underfill material may be retained. Thus, voids and back contamination may be limited to assemble a reliable semiconductor device