Porous Thermal Coupling for Low-Resistance Cooling Interfaces
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Solution Overview
Problem
Existing thermal management solutions for power electronics modules face challenges in achieving low thermal resistance, flexibility to compensate for production tolerances, and durability under temperature fluctuations, with soldered connections being rigid and difficult to adapt and heat conducting pastes offering high thermal resistance and limited durability.
Innovation Solution
A system comprising a porous metal connecting body filled with a low-melting alloy or fluorinated organic liquid, which provides a flexible and cost-effective thermal coupling with a cooling element, allowing for geometric adaptation and efficient heat dissipation while maintaining mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soldered connection is used between the cooling element and the component, then the thermal resistance is reduced, but the connection becomes rigid and cannot compensate for geometric deviations
Solution Approach 1:
The patent employs a porous connecting body made of metal foam material that can be compressed to adapt to geometric deviations between the cooling element and component. The porous structure allows for compression while maintaining thermal conductivity, resolving the contradiction between low thermal resistance and geometric adaptability.
Solution Approach 2:
The connecting element combines metal foam material with phase change material to create a composite structure. The metal foam provides mechanical support and thermal conductivity, while the phase change material enhances heat transfer and fills voids, achieving both low thermal resistance and adaptability to geometric variations.
2Adaptability or versatility
If a heat conducting paste is used to couple the cooling element, then the connection is detachable and flexible, but the thermal resistance is higher and durability is reduced
Solution Approach 1:
The porous metal foam structure provides a solid, durable connection medium with inherent thermal conductivity, replacing the heat conducting paste. The porous structure can be compressed to accommodate geometric variations while maintaining structural integrity and low thermal resistance, eliminating the durability issues of paste-based solutions.
Solution Approach 2:
The patent utilizes phase change material within the porous structure that changes phase in response to temperature variations. This parameter change allows the connecting element to adapt its physical properties dynamically, maintaining both flexibility for geometric adaptation and low thermal resistance under varying operating conditions.
3Strength
If a soldered connection is used, then the connection is permanent and structurally sound, but it is difficult to exchange elements and compensate for production tolerances
Solution Approach 1:
The connecting element is designed as a separate, replaceable component between the cooling element and the component. This segmentation allows individual elements to be exchanged independently while maintaining a strong thermal connection, resolving the contradiction between connection strength and ease of manufacture.
Solution Approach 2:
The porous connecting body is designed to be compressible and adaptable, allowing it to maintain strong thermal contact while accommodating variations in assembly. This dynamic property enables easy assembly and disassembly without compromising connection strength, facilitating element exchangeability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low thermal resistance, flexibility to compensate for production tolerances, and durability under temperature fluctuations, ensuring effective heat transfer and mechanical stability, thus addressing the limitations of existing solutions.
Implementation Method 1
a connecting element (300) that is arranged between the component (100) and the cooling element (200) and that thermally couples the cooling element (200) to the component (100)
Implementation Method 2
The connecting element (300) comprises a porous connecting body (310) that is made from a metal material, wherein the pores (311) of the connecting body (310) are at least in part filled with a filling material (320), wherein the filling material (320) has a phase change material
Data Source
AI summary
Various embodiments of the teachings herein include an apparatus comprising: a component; a cooling element; and a connecting element arranged between the component and the cooling element to thermally couple the cooling element to the component. The connecting element comprises a porous connecting body including a metal material. Pores of the connecting body are at least in part filled with a filling material including a low-melting alloy or a fluorinated organic liquid.