Thermal interface materials for immersion cooled data storage devices

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Data storage systems face challenges in maintaining temperature control due to heat generation, as traditional cooling methods like fans induce vibrations and limit system density, while immersion in dielectric liquids can be hindered by thermal interface materials that block coolant flow.

Innovation Solution

Incorporating a porous thermal interface material between the printed circuit board and base deck in data storage devices, allowing coolant to flow through channels and effectively manage heat transfer, reducing the need for fans and enhancing cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional cooling methods like fans are used, then cooling is provided, but vibrations are induced and system density is limited

Engineering Contradiction:

Improvecooling efficiencyVSAvoidvibrations and noise

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical cooling system (fans) with a liquid immersion cooling system. The dielectric liquid directly contacts the data storage device components, absorbing heat through conduction and convection without any moving mechanical parts, thereby eliminating vibrations and acoustic noise while maintaining effective cooling.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a hydraulic cooling mechanism by using dielectric liquid to transfer heat away from the data storage device. The liquid circulates through the immersion cooling system, absorbing thermal energy from hot components and transporting it to heat exchangers, providing cooling through fluid dynamics rather than mechanical motion.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Temperature

If immersion in dielectric liquids is used, then cooling efficiency is improved, but thermal interface materials block coolant flow

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcoolant flow

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent specifies that the thermal interface material between the printed circuit board and base deck should be porous rather than solid. This porous structure allows the dielectric liquid coolant to penetrate through the interface material and directly contact heat-generating components, ensuring unobstructed coolant flow while maintaining thermal conduction pathways for effective heat transfer.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The patent employs composite thermal interface materials that combine properties of both thermal conduction and fluid permeability. These composite materials integrate porous structures with thermally conductive properties, allowing them to serve dual functions: conducting heat from components while simultaneously permitting coolant flow through their porous matrix, thus resolving the conflict between thermal management and coolant accessibility.

Inventive Principle:

Principle #40Composite materials

3Temperature

If fans are used for cooling, then heat is removed, but system density is limited

Engineering Contradiction:

Improveheat removalVSAvoidsystem density

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

By replacing fan-based mechanical cooling with immersion cooling, the system eliminates the need for large air circulation components. The dielectric liquid provides direct contact cooling, allowing for more compact heat dissipation mechanisms and enabling higher system density without sacrificing cooling performance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The immersion cooling system merges the cooling function directly into the operational environment of the data storage devices. The dielectric liquid serves as both the operating medium and the cooling agent, eliminating the need for separate cooling infrastructure and allowing for denser system configuration.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient heat removal from data storage devices during immersion, minimizing acoustic noise and increasing system density by allowing coolant to flow through the thermal interface material, thereby maintaining optimal operating temperatures without the drawbacks of traditional cooling methods.

Implementation Method 1

a thermal interface material positioned between the printed circuit board and the base deck and comprising channels therethrough

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

passing the dielectric liquid through the channels of the thermal interface material

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11069383B1Thermal interface materials for immersion cooled data storage devices

Publication Date: 2021.07.20 SEAGATE TECH LLC

AI summary

A data storage device includes a base deck coupled to a top cover. The data storage device includes a printed circuit board coupled to and spaced from the base deck. The data storage device also includes a thermal interface material positioned between the printed circuit board and the base deck and comprising a porous material.