Porous Insulated Wire Coating With Low Dielectric and Strong Adhesion
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Solution Overview
Problem
The formation of pores in the insulation film of insulated wires reduces the adhesion between the conductor and the insulation film, leading to potential decreases in adhesion and increased relative dielectric constant.
Innovation Solution
The insulated wire is designed with an insulation film containing multiple pores, with an opening area ratio of 20% or less, achieved by using a specific manufacturing process involving a coating material that includes a thermally decomposable polymer or core/shell type fine particles, which are thermally decomposed to create pores, maintaining high adhesion and low relative dielectric constant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pores are formed in the insulation film to increase PDIV, then the insulation performance is improved, but the adhesion between the conductor and insulation film decreases
Solution Approach 1:
The patent applies local quality by creating pores only in specific regions of the insulation film (not uniformly throughout), and by controlling the opening area ratio to be 20% or less at the conductor interface. This localized pore formation allows the insulation film to have high PDIV in bulk while maintaining good adhesion at the conductor interface.
Solution Approach 2:
The patent utilizes porous materials by incorporating multiple pores into the insulation film structure. The pores are formed with controlled distribution and size, creating a porous insulation film that achieves both high PDIV (through air-filled pores) and adequate adhesion (by limiting opening area ratio to 20% or less at the conductor interface).
2Reliability
If the opening area ratio of pores is increased to reduce relative dielectric constant, then the electrical performance is improved, but the adhesion between conductor and insulation film decreases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the opening area ratio parameter to be 20% or less. This parameter optimization allows the insulation film to achieve low relative dielectric constant (improved electrical performance) while maintaining sufficient adhesion strength. The parameter control is achieved through specific manufacturing processes that regulate pore formation and distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains high adhesion between the conductor and insulation film while reducing the relative dielectric constant, enhancing the wire's performance and durability.
Implementation Method 1
a coating material that includes a thermally decomposable polymer or core/shell type fine particles, which are thermally decomposed to create pores
Data Source
AI summary
The insulated wire has a conductor having a long shape, and an insulation film including multiple pores and covering the conductor, wherein an opening area ratio SR measured by a method below is 1% or less. The method of measuring the opening area ratio SR includes peeling the insulation film from the conductor; obtaining a SEM image showing an interface on a conductor side in the insulation film peeled; calculating an area S1 of an observation region that is at least a part of the SEM image; and an area S2 of portions where the multiple pores are open in the observation region; and calculating the opening area ratio SR by the following Formula: SR=(S2/S1)×100.