Portable Heat Dissipation Layout With Multi-Path Heat Transfer
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Solution Overview
Problem
The shrinking internal space in lightweight and thin portable electronic devices limits the heat dissipation capacity, making it difficult to effectively manage heat generated by processing elements like CPUs and GPUs, leading to potential overheating and failure.
Innovation Solution
A heat dissipation system is configured with multiple heat transferring members, including heat pipes, that strategically divert and store heat between processing elements and a heat dissipation module, allowing for additional diversion and storage locations to reduce the burden on the heat dissipation module and delay temperature increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is disposed on electronic elements to perform heat dissipation, then heat dissipation capacity is improved, but device weight and volume increase
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated heat dissipation module that serves multiple processing elements simultaneously. The module includes a heat dissipation chamber that receives heat from both the first and second processing elements, eliminating the need for separate fan assemblies for each element and reducing overall device weight and volume.
Solution Approach 2:
The heat dissipation module is designed as a universal solution that can handle heat from multiple different processing elements (CPU, GPU, NPU, etc.) through a single chamber and fan assembly. The module's universal design allows it to serve multiple functions of cooling different components, thereby reducing the need for multiple specialized heat dissipation systems.
2Temperature
If a fan is disposed on electronic elements to perform heat dissipation, then heat dissipation capacity is improved, but device thickness increases
Solution Approach 1:
The heat dissipation module employs a nested structure where the heat dissipation chamber is positioned between the first and second processing elements, with the fan assembly nested within the chamber. This nesting arrangement allows the heat dissipation components to be compactly integrated within the device's thickness, minimizing the overall device profile while maintaining effective heat dissipation capability.
3Weight of moving object
If heat dissipation module capacity is limited due to internal space constraints, then device portability is improved, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The patent segments the heat transfer function into multiple heat transferring members (first heat transferring member and second heat transferring member) that independently conduct heat from different processing elements to the heat dissipation module. This segmentation allows for optimized heat transfer paths for each component, maximizing the efficiency of the limited heat dissipation module capacity and improving overall heat dissipation effectiveness within compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the heat dissipation capacity by providing additional heat diversion and storage paths, preventing rapid temperature rise and ensuring effective heat management even with limited heat dissipation module capacity.
Implementation Method 1
the first heat transferring member is in thermal contact with the first region, the second processing element and the heat dissipation module
Implementation Method 2
the second heat transferring member is in thermal contact with the second region and the heat dissipation module
Implementation Method 3
A third heat transferring member is included, comprising a heat pipe, which is in thermal contact with a third region of the first processing element, the heat dissipation module and the second processing element
Data Source
Figure 1
Figure 2
AI summary
A heat dissipation system (100) of a portable electronic device including a first processing element (110), a second processing element (120), a heat dissipation module (130) located between the first processing element (110) and the second processing element (120), a first heat transferring member (P1), and a second heat transferring member (P2), is provided. The first processing element (110) has a first region (111a) and a second region (111b). The first heat transferring member (P1) is in thermal contact with the first region (111a), the second processing element (120), and the heat dissipation module (130). The second heat transferring member is in thermal contact with the second region and the heat dissipation module (130).