Portable Device Height Adjuster for Thermal Expansion
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Solution Overview
Problem
Portable electronic devices face challenges in heat dissipation due to their thin profiles, leading to increased temperatures near the keyboard area, which affects comfort and usability.
Innovation Solution
A portable electronic device with a method to expand the inner space between its upper and lower surfaces using a height adjuster, controlled by a processor based on temperature thresholds, to enhance air flow and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the main body is designed with a thin profile, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent implements a dynamic space expansion mechanism that adjusts the inner space volume between upper and lower surfaces based on temperature conditions. When temperature exceeds a threshold, the processor activates the height adjuster to expand the inner space, creating a dynamic adaptation system that maintains thin profile during normal operation while providing enhanced cooling when needed.
Solution Approach 2:
The patent utilizes the vertical dimension (distance between upper and lower surfaces) to create expandable cooling space. By increasing the height of the inner space in the vertical direction rather than expanding horizontal dimensions, the system achieves improved heat dissipation while maintaining a compact overall footprint suitable for portability.
2Length of moving object
If the main body is designed with a thin profile, then portability is improved, but keyboard area temperature increases
Solution Approach 1:
The system dynamically responds to temperature conditions by expanding the inner space when keyboard area temperature becomes excessive. This dynamic adjustment ensures that during normal operation the device maintains its thin, portable form factor, but when thermal conditions threaten keyboard usability, the system automatically creates additional cooling volume to restore comfortable operating temperatures.
3Temperature
If the inner space is expanded to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The height adjuster mechanism serves multiple functions: it expands the inner space for heat dissipation, maintains structural integrity during thermal expansion, and can be integrated with existing device components. This multi-functionality reduces the need for separate dedicated cooling structures, thereby limiting the increase in overall device complexity while achieving improved thermal management.
Solution Approach 2:
The system employs a self-regulating mechanism where the processor monitors temperature conditions and automatically activates the space expansion when thermal thresholds are exceeded. This self-service approach eliminates the need for manual intervention or complex external control systems, allowing the device to autonomously manage its thermal state while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The expanded space improves heat dissipation efficiency, reducing temperatures and maintaining device performance while allowing for thinner profiles.
Implementation Method 1
expands an inner space between an upper surface and a lower surface defined with a main body, thereby improving heat dissipation
Implementation Method 2
controlled by a processor based on temperature thresholds
Implementation Method 3
enhance air flow and heat dissipation
Data Source
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AI summary
An electronic device and method are disclosed herein. The electronic device includes a processor, a temperature sensor, a main board on which the processor and the temperature sensor are mounted, a main body including a first surface and a second surface, an input device disposed on the first surface and the main board disposed on the second surface, wherein the first surface and second surface define a hollow in which the main board is disposed, a display, height adjuster disposed between the first and second surfaces and including a connection terminal connected to the processor, an extendable bar connected to the connection terminal, and a spacer connected to the extension bar. The processor implements the method, including in response to receiving a detection signal from the temperature sensor, control actuation of the height adjuster to cause expansion or contraction of the hollow by movement of the first and second surfaces.