Portable temperature-controlled front-loaded enclosure with optimized solid-state cooling system
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Solution Overview
Problem
Traditional portable cooling systems for temperature-sensitive materials face challenges in maintaining precise temperature control due to inefficiencies in heat transfer and power consumption, particularly in compact designs requiring extended autonomous operation.
Innovation Solution
A portable temperature-controlled enclosure with a front-loaded aluminum payload chamber and a semiconductor chip mounted at a calculated angular orientation, utilizing a closed-loop cooling mechanism and thermally coupled to a semiconductor chip for efficient heat transfer, supported by a dual-power system and advanced control systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional compressor-based cooling systems are used, then cooling capability is achieved, but power consumption increases and portability is reduced
Solution Approach 1:
The patent replaces the mechanical compressor-based cooling system with a solid-state semiconductor cooling system. The semiconductor chip directly converts electrical energy into thermal energy transfer without moving parts, eliminating the mechanical complexity and high power consumption of traditional compressors while maintaining reliable temperature control through solid-state thermoelectric cooling.
Solution Approach 2:
The patent changes the operating parameters by using low-voltage DC power (5V USB power) instead of high-voltage AC power, and employs pulse-width modulation (PWM) control to dynamically adjust the cooling power. This allows the system to achieve effective cooling with significantly reduced power consumption compared to traditional compressor systems.
2Volume of moving object
If compact design is implemented, then portability is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The patent addresses the heat transfer challenge in compact design by transitioning from conventional air cooling to liquid cooling. The closed-loop liquid cooling system uses a coolant circulating through channels to efficiently remove heat from the semiconductor chip, achieving superior heat transfer in a compact volume where air cooling would be insufficient.
Solution Approach 2:
The patent introduces a liquid coolant as an intermediary substance to facilitate heat transfer from the semiconductor chip to the heat exchanger. This liquid intermediary enables efficient thermal energy transfer in the compact enclosure, overcoming the limitations of direct solid-to-air heat transfer in confined spaces.
3Duration of action of moving object
If extended autonomous operation is achieved, then duration of action is improved, but power consumption increases
Solution Approach 1:
The patent implements periodic cooling action through PWM control, where the semiconductor cooling system operates in intermittent cycles rather than continuously. The control system monitors temperature and activates cooling only when needed, allowing the battery to last up to 72 hours of autonomous operation while maintaining precise temperature control during critical periods.
Solution Approach 2:
The patent incorporates a phase change material (PCM) that absorbs and stores thermal energy during cooling cycles, then releases it during warmer periods. This thermal energy recovery mechanism reduces the overall power consumption by utilizing stored thermal energy, thereby extending autonomous operation duration without proportionally increasing power usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves precise temperature control (2-8°C) for up to 72 hours on battery power, maintaining stability across varying environments, eliminating the need for traditional cooling components and enhancing thermal management.
Implementation Method 1
thermally coupled to a semiconductor chip for efficient heat transfer
Implementation Method 2
closed-loop cooling mechanism that is thermally coupled to the semiconductor chip
Data Source
AI summary
In one aspect, a portable temperature-controlled enclosure represents an innovative cooling solution featuring a front-loaded aluminum payload chamber designed for easy access and efficient storage. The device's core technology centers around a semiconductor chip that is uniquely mounted at a calculated angular orientation relative to the chamber wall, creating an optimized cooling pattern throughout the enclosure. The system incorporates a sophisticated closed-loop cooling mechanism that is thermally coupled to the semiconductor chip for maximum heat transfer efficiency. To ensure reliable operation in various settings, the enclosure includes a versatile power system capable of running on both standard wall power and battery power for portable use. The entire system is managed by an advanced control system that continuously monitors and maintains precise target temperatures within the front-loaded payload chamber, making it ideal for applications requiring strict temperature control.