Portable Wireless Sensor for Semiconductor Fabrication Monitoring

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Solution Overview

Problem

Existing semiconductor fabrication sensors are limited in measuring key process parameters, are often wired, and difficult to disassemble or integrate with additional functionalities, restricting their capability to monitor multiple parameters simultaneously.

Innovation Solution

A portable wireless sensor system that includes multiple sensors to measure different fabrication process parameters, a signal converter to digitize analog data, and a wireless transceiver to transmit modulated data, allowing for integrated, multi-functional monitoring and real-time data analysis.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If wired sensors are used in semiconductor fabrication, then reliable data transmission is achieved, but ease of disassembly and portability deteriorate

Engineering Contradiction:
Improveease of disassemblyVSAvoiddata transmission reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent replaces wired mechanical connections with wireless communication technology. The sensor system uses wireless transceivers to transmit data without physical cables, eliminating the mechanical constraints that prevent easy disassembly while maintaining reliable data transmission through wireless protocols.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If single-parameter sensors are used, then device complexity is reduced, but adaptability to measure multiple parameters deteriorates

Engineering Contradiction:
Improvecapability to measure multiple parametersVSAvoidsensor integration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal sensor platform where a single sensor device can measure multiple fabrication parameters simultaneously. The system integrates multiple sensing capabilities (temperature, pressure, flow, etc.) into one portable unit with wireless communication, allowing the same device to monitor various process parameters without requiring separate specialized sensors for each parameter.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If vendor-designed fabrication tools are used, then manufacturing precision is maintained, but adaptability to measure key process parameters deteriorates

Engineering Contradiction:
Improvecapability to measure key process parametersVSAvoidfabrication process control
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent introduces an intermediary portable wireless sensor system that interfaces between the existing vendor-designed fabrication tools and the measurement requirements. These external sensors can be positioned near or on the fabrication tools to capture additional key process parameters without modifying the original tool design, thereby maintaining manufacturing precision while expanding measurement capabilities.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS8676537B2Portable wireless sensor
Publication Date: 2014.03.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US8676537B2 patent drawing
  • US8676537B2 patent drawing
  • US8676537B2 patent drawing

AI summary

The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a portable device. The portable device includes first and second sensors that respectively measure first and second fabrication process parameters. The first fabrication process parameter is different from the second fabrication process parameter. The portable device also includes a wireless transceiver that is coupled to the first and second sensors. The wireless transceiver receives the first and second fabrication process parameters and transmits wireless signals containing the first and second fabrication process parameters.