Position-Controlled Waveguides With Deep-Trench Z Alignment

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Solution Overview

Problem

Existing electrical interconnects struggle to meet the increasing demands for high data rate signaling and sustainable bandwidth due to limitations in energy efficiency and alignment challenges in optical interconnects, particularly in the z-direction, which affect the reliability of data transfer between photonic integrated circuits and fiber array units.

Innovation Solution

A method for manufacturing position-controlled waveguides by etching a deep trench in a substrate and depositing a buffer material to precisely align waveguides in the x-, y-, and z-positions, using a feedback loop for depth control, followed by deposition of waveguide material and optional graded index of refraction interfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional lithography techniques are used to manufacture waveguides, then manufacturing cost is reduced, but alignment precision in the z-direction deteriorates

Engineering Contradiction:

Improvealignment precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent segments the waveguide manufacturing process into multiple independent steps: forming trenches at desired depths, depositing buffer materials to control z-position, and then adding waveguide material. This segmentation allows each step to be optimized independently, achieving high alignment precision without requiring expensive laser direct writing equipment throughout the entire process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary actions by pre-forming trenches to the exact desired depth and pre-depositing buffer materials to the precise z-position before adding the waveguide material. This preliminary preparation ensures that when the waveguide material is deposited, it automatically achieves the correct alignment in all three dimensions, eliminating the need for post-manufacturing adjustment or expensive real-time control equipment.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If laser direct writing is used to create waveguides, then alignment precision is improved, but manufacturing cost increases

Engineering Contradiction:

Improvealignment precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces expensive, complex laser direct writing equipment with simpler, more cost-effective deposition and etching equipment. The process uses standard semiconductor manufacturing tools to create temporary structures (trenches and buffer layers) that are later removed or integrated, achieving the same alignment precision as laser direct writing but at a fraction of the equipment and operational cost.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Use of energy by moving object

If electrical interconnects are used for data transfer, then manufacturing simplicity is maintained, but energy efficiency deteriorates at high data rates

Engineering Contradiction:

Improveenergy efficiencyVSAvoiddata rate

Core Design Contradiction:

Use of energy by moving objectVSProductivity

Solution Approach 1:

The patent enables optical interconnects that fundamentally change the transmission medium from electrical conductors to optical waveguides. This parameter change allows data transfer at much higher rates with significantly improved energy efficiency, as optical signals can carry more information per unit time and experience less signal degradation over distance compared to electrical signals in traditional interconnects.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate alignment of waveguides in all directions, enhancing data transfer reliability and efficiency while reducing costs compared to laser direct writing, and offering higher alignment precision than traditional lithography techniques.

Implementation Method 1

depositing a buffer material to precisely align waveguides in the x-, y-, and z-positions

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

followed by deposition of waveguide material

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 3

etching a deep trench in a substrate

Methodology Applied

Scientific EffectPlasma Etching: Plasma

Data Source

PatentUS12449600B2Position controlled waveguides and methods of manufacturing the same

Publication Date: 2025.10.21 INTEL CORP

AI summary

Position controlled waveguides and methods of manufacturing the same are disclosed. An example apparatus includes a substrate with a channel that extends into a first surface of the substrate to a second surface of the substrate, wherein the second surface is recessed relative to the first surface; buffer material having a first index of refraction on the second surface of the substrate; and a waveguide on the buffer material, the waveguide having a second index of refraction that is higher than the first index of refraction.