Position Detection Device Noise Removal for Imprint Alignment
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Solution Overview
Problem
The accuracy of position adjustment in imprint methods for manufacturing articles like semiconductor devices and MEMS is compromised by noise in the signals used for aligning mold and substrate marks, which affects the precision of pattern transfer.
Innovation Solution
A position detection device that includes a detection unit for capturing light from mold and substrate marks and a processing unit to obtain the positional relationship between the mold and substrate by removing noise components from the detected signals, utilizing a configuration that shares optical members between the detection and illumination systems to enhance signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a signal is used for position adjustment, then the position of the mold and substrate can be adjusted, but noise in the signal reduces the accuracy of the position adjustment
Solution Approach 1:
The patent segments the detection signal into two distinct components: a first signal component derived from light reflected by the mold mark, and a second signal component derived from light transmitted through the substrate mark. By separating these components, the system can process them differently to eliminate noise while preserving the useful alignment information.
Solution Approach 2:
The patent extracts and removes the first signal component (containing noise from the mold mark) from the composite detection signal. This extraction isolates the useful second signal component from the substrate mark, eliminating the harmful noise while retaining the position adjustment information needed for accurate alignment.
2Measurement precision
If the mold mark is used for position detection, then the position can be detected, but noise occurs due to the mark formed on the mold which decreases accuracy
Solution Approach 1:
The patent extracts the first signal component generated by the mold mark and removes it from the detection signal. This extraction eliminates the noise generated by the mold mark while preserving the useful information from the substrate mark, thereby improving position detection accuracy.
Solution Approach 2:
The patent converts the harmful noise effect into a beneficial separation process. By detecting that the first signal component (noise source) and second signal component (useful signal) can be spatially or optically separated, the system uses the presence of the mold mark signal to enable its own removal, turning the harmful noise into an opportunity for noise elimination.
3Measurement precision
If noise removal processing is applied to the detected signal, then the accuracy of position adjustment is improved, but the device complexity increases
Solution Approach 1:
The patent replaces complex mechanical or computational noise filtering systems with a simpler optical separation approach. By designing the detection system to naturally separate the first and second signal components through optical paths (reflection vs. transmission), the noise removal is achieved through optical design rather than complex signal processing algorithms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the accuracy of position detection and alignment by isolating and removing noise, resulting in higher precision in transferring patterns from the mold to the substrate, thereby reducing defects in the manufacturing process.
Implementation Method 1
a detection unit configured to detect light from the mold mark and light through the substrate mark
Data Source
AI summary
A position detection device for adjusting positions of a mold and a substrate using a mold mark formed on the mold and a substrate mark formed on the substrate includes a detection unit configured to detect light from the mold mark and the substrate mark, and a processing unit configured to obtain a positional relationship between the substrate and the mold based on a detection result of the detection unit, wherein the processing unit obtains the positional relationship between the substrate and the mold based on a corrected signal obtained by removing a noise component based on the light from the mold mark from a detected signal based on the light from the mold mark and the substrate mark.