Position Distribution Graph Updating for PCB Exposure Accuracy
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Solution Overview
Problem
In the PCB industry, the increasing demand for high-density interconnects and smaller line widths poses challenges in achieving accurate exposure and alignment due to non-uniform laser spot distribution and physical limitations, leading to insufficient exposure accuracy.
Innovation Solution
A method and system for generating and updating position distribution graphs using exposure simulation, error distribution analysis, and zero-one integer programming to optimize the placement of position points for improved exposure accuracy, allowing a larger light spot to expose small line widths effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a larger light spot is used for exposure, then exposure efficiency is improved, but exposure accuracy deteriorates due to non-uniform laser spot distribution
Solution Approach 1:
The patent divides the exposure process into multiple passes, exposing different regions sequentially. The position distribution graph is segmented into multiple position points that are exposed in different stages, allowing each point to receive precise exposure while maintaining overall efficiency.
Solution Approach 2:
The patent applies different exposure parameters to different position points based on their specific requirements. Each position point in the position distribution graph has customized exposure settings, ensuring local optimization of exposure accuracy while maintaining overall process efficiency.
2Quantity of substance
If line width and line spacing are reduced to achieve high-density interconnects, then circuit density is improved, but alignment accuracy deteriorates
Solution Approach 1:
The patent performs preliminary generation of the position distribution graph before the actual exposure process. This pre-planning stage calculates optimal position points and exposure parameters, ensuring that subsequent exposure and alignment operations can achieve high precision even with reduced line widths and spacing.
Solution Approach 2:
The patent incorporates feedback mechanisms where exposure results are analyzed and used to adjust subsequent exposure parameters. The system compares actual exposure outcomes with target specifications and refines the position distribution graph accordingly, maintaining alignment accuracy in high-density configurations.
3Speed
If multiple position points are exposed simultaneously, then exposure speed is improved, but exposure uniformity deteriorates
Solution Approach 1:
The patent segments the position distribution graph into multiple position points that are exposed in sequential passes rather than simultaneously. This segmentation maintains exposure uniformity by ensuring each point receives consistent energy while still achieving high overall exposure speed through efficient multi-pass processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances exposure accuracy by determining optimal position points for laser exposure, enabling precise alignment and correction, thus meeting the requirements for high-density interconnects and small line widths.
Implementation Method 1
performing an exposure simulation according to each of said at least one position distribution graph to generate at least one exposure result graph, wherein the exposure simulation comprises forming a virtual spot according to each of the plurality of position points
Data Source
AI summary
A method for generating and updating position distribution graph comprises: generating a position distribution graph according to a circuit bitmap and an exposure pattern, performing an exposure simulation according to the position distribution graph to generate an exposure result graph, comparing the circuit bitmap with the exposure result graph to generate a plurality of error distribution candidate graphs, selecting one of the error distribution candidate graphs to serve as an error distribution graph, and performing a zero-one integer programming to update the position distribution graph according to the circuit bitmap and the error distribution graph, wherein the updated position distribution graph is associated with the error distribution graph.