Position Indicator LC Resonant Circuit Laser Interconnect Cutting
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Solution Overview
Problem
The existing methods for manufacturing position indicators in touch input systems face challenges in accurately adjusting the resonant frequency of LC resonant circuits due to manufacturing errors, requiring manual interconnect cutting, which is costly and inefficient, and cannot reverse the isolation of capacitors, limiting frequency readjustment capabilities.
Innovation Solution
A position indicator design that includes a rectangular substrate with land patterns to protect the substrate during laser interconnect cutting, allowing for efficient and automated cutting while enabling the reintegration of isolated capacitors into the circuit, using a combination of interconnects and land patterns formed by etching an electrically-conductive film, and manual jumper positions for backup cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual interconnect cutting is used to adjust resonant frequency, then frequency adjustment is possible, but work cost is high and productivity is low
Solution Approach 1:
The patent replaces manual mechanical cutting with automated laser cutting to adjust interconnects. The laser cutting apparatus automatically cuts land patterns based on predetermined positions without manual intervention, thereby reducing labor costs and increasing productivity while maintaining the ability to adjust resonant frequency.
Solution Approach 2:
The patent pre-arranges multiple land patterns at predetermined positions on the substrate before assembly. These land patterns are designed to be cut by laser at specific locations to isolate capacitors. The preliminary placement of these cuttable land patterns enables automated frequency adjustment without requiring manual decision-making during the cutting process.
2Extent of automation
If laser is used to cut interconnects, then automation is achieved and work cost is reduced, but large hollow regions are generated in the thin substrate
Solution Approach 1:
The patent divides the substrate into multiple regions with land patterns positioned at specific locations. Instead of cutting through the entire substrate thickness in one operation, the laser cutting is segmented into multiple passes or targeted at specific land pattern regions. This segmentation allows controlled cutting that isolates capacitors while minimizing the generation of large hollow regions that would penetrate through the thin substrate.
Solution Approach 2:
The patent applies laser cutting with controlled parameters specifically at the land pattern locations rather than uniform cutting across the substrate. The land patterns are designed with specific geometries and positions that concentrate the cutting action where needed while protecting surrounding areas. This localised approach ensures automation is achieved without causing excessive substrate damage or large hollow regions.
3Measurement precision
If capacitors are isolated from the circuit by cutting, then resonant frequency is adjusted, but the isolated capacitors cannot be reintegrated into the circuit
Solution Approach 1:
The patent designs the land patterns and interconnect structure to be dynamically reconfigurable. The land patterns are positioned and shaped such that laser cutting can isolate capacitors when needed for frequency adjustment, but the remaining land pattern structures maintain electrical connectivity pathways. This dynamic design allows the circuit topology to change from connected to isolated states while preserving the possibility of future reconnection through additional laser cutting or soldering at the land pattern locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient laser interconnect cutting, reduces manufacturing costs, and allows for the reintegration of isolated capacitors, facilitating resonant frequency adjustments and improving production efficiency by minimizing substrate damage and enabling flexible capacitor reconnection.
Implementation Method 1
a method of cutting interconnects not by manual work but by a laser will be possible
Implementation Method 2
an induced electromotive force is generated in the coil, whereby power is stored in the LC resonant circuit
Data Source
AI summary
A position indicator includes: a chassis; a substrate disposed inside the chassis; a coil; capacitors disposed on the substrate; interconnects disposed on the substrate such that each at least partially connects a respective one of the capacitors to the coil in parallel; and pairs of land patterns. Each pair of land patterns includes a first land pattern and a second land pattern. Each of the interconnects has a first end connected to a first end of the coil and a second end connected to a second end of the coil, and is connected to one of the capacitors. The pairs of land patterns are disposed such that each of the interconnects is at least partially interposed between the first land pattern and the second land pattern of one of the pairs of land patterns.