Heat-Dissipating Positioning Sleeve for Screwless Board Assembly

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing assembly methods using screws for industrial products cause damage to components and hinder disassembly for repair or replacement, while traditional heat dissipation devices require space for screws and affect heat dissipation efficiency.

Innovation Solution

A positioning device with a limiting mechanism comprising a sleeve, adjusting device, and base, which integrates non-planar heat dissipation fins and allows for easy assembly and disassembly of board members, utilizing materials with high thermal conductivity for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If screw locking is used to assemble components, then components can be disassembled for repair or replacement, but the screw heads may cause damage such as denting or chipping to the component surfaces

Engineering Contradiction:
Improvedisassembly for repairVSAvoidcomponent damage
Core Design Contradiction:
Ease of repairVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a positioning device with a limiting mechanism as an intermediary component between the board and the assembly structure. The limiting mechanism includes a positioning portion that engages with positioning holes and a limiting portion that restricts the insertion depth of screws, preventing screw heads from contacting and damaging the board surface while still allowing secure assembly and disassembly for repair purposes

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation device is assembled using screws, then the heating element can dissipate heat, but the space required for screw locking reduces the heat dissipation efficiency

Engineering Contradiction:
Improveheat dissipationVSAvoidspace for screw locking
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the positioning function and heat dissipation function into a single integrated component. The positioning device with limiting mechanism serves both to position the heat dissipation device accurately and to provide heat dissipation through its structure, eliminating the need for separate screw locking mechanisms and maximizing the heat dissipation surface area

Inventive Principle:
Principle #5Merging (Combining)

3Object-affected harmful factors

If welding and fixation are used to assemble components, then component damage is avoided, but disassembly for repair or replacement becomes difficult

Engineering Contradiction:
Improvecomponent damageVSAvoiddisassembly for repair
Core Design Contradiction:
Object-affected harmful factorsVSEase of repair

Solution Approach 1:

The patent employs a dynamic assembly system using the limiting mechanism that allows the assembly to be easily disassembled and reassembled. The positioning portion and limiting portion create a reversible connection that maintains component integrity without permanent fixation, enabling both damage prevention and easy repair through multiple assembly cycles

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates easy assembly and disassembly of components while enhancing heat dissipation by providing a high thermal conductivity path for heat removal, reducing component damage and improving overall performance.

Implementation Method 1

the sleeve comprises an accommodating space defined therein for assembling the adjusting device, and a non-planar heat dissipation portion located on the outer side thereof

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the sleeve of the limiting mechanism can be used to assist the preset second board member in heat dissipation

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20250273537A1Positioning device with heat dissipation effect
Publication Date: 2025.08.28 HANWIT PRECISION IND LTD
  • US20250273537A1 patent drawing
  • US20250273537A1 patent drawing
  • US20250273537A1 patent drawing

AI summary

A positioning device with heat dissipation effect, includes a limiting mechanism including a sleeve and an adjusting device located inside the sleeve, and a base set at the bottom side of the sleeve. The sleeve has an accommodating space for assembling the adjusting device and is provided with a non-planar heat dissipation portion. The adjusting device includes a coupling member having a connecting part and an operating part, and an elastic member sleeved on the coupling member. The base has a docking portion, and a connecting portion on one side of the docking portion for the connecting part to be assembled at the connecting portion. A first board member can be assembled at the docking portion of the base and a second board member can be assembled at the bottom of the sleeve, so that the sleeve can assist the second board member in dissipating heat.