Positive Plate Laser Cutting Without Active Material Splashing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laser cutting of lithium-ion cell positive plates results in severe material splashing due to violent reduction reactions between the carrier aluminum foil and ternary positive electrode material, leading to quality issues and reduced cutting efficiency.
Innovation Solution
A laser cutting method that involves removing active materials from the surface of the positive plate using laser irradiation or chemical agents, followed by layered cutting with lasers of varying energy densities to avoid splashing and ensure high cutting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is performed directly on the positive plate without removing active material, then cutting speed is maintained, but material splashing occurs severely and cut quality deteriorates
Solution Approach 1:
The patent applies preliminary action by removing the active material layer from the positive plate surface before performing laser cutting. This preparatory step eliminates the source of splashing and allows subsequent cutting to proceed without material contamination, thereby maintaining both high cutting speed and excellent cut quality without the trade-off present in conventional methods
2Productivity
If laser cutting is performed on positive plates with active material, then cutting efficiency is high, but material splashing and bead formation occur
Solution Approach 1:
The patent applies the extraction principle by removing the active material layer from the positive plate surface before laser cutting. This extraction eliminates the reactive material that causes splashing and bead formation during cutting, allowing the carrier foil to be cut cleanly without generating harmful splashing effects, thus maintaining high cutting efficiency while eliminating material contamination
3Manufacturing precision
If active material is removed before laser cutting, then material splashing is prevented and cut quality improves, but additional process steps are required
Solution Approach 1:
The patent applies the merging principle by integrating the active material removal step with the laser cutting process into a single unified operation. The laser system performs both functions sequentially in one pass, eliminating the need for separate removal and cutting equipment, thereby improving cut quality while avoiding significant increases in device or process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents material splashing, maintains the quality of the positive plate, and enhances cutting efficiency by controlling the laser energy density and removing active materials before cutting.
Implementation Method 1
performing laser irradiation on the preset position of the to-be-cut part to remove the active material on the surface of the to-be-cut part
Data Source
AI summary
The present disclosure discloses a laser cutting method, which relates to the technical field of laser cutting. The laser cutting method first removes the active material on the surface of a preset position of a to-be-cut part; and then performs the laser cutting on the to-be-cut part at the preset position to cut off the to-be-cut part. Compared with the prior art, since the laser cutting method provided by the present disclosure performs the step of removing the active material on the surface of the preset position of the to-be-cut part, the quality of the to-be-cut part can be guaranteed, the occurrence of material splashing can be avoided, the steps are simple, and the cutting efficiency is higher.