Positive Plate Laser Cutting to Prevent Electrode Material Splashing
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Solution Overview
Problem
Laser cutting of lithium-ion cell positive plates results in severe material splashing due to violent reduction reactions between the carrier aluminum foil and ternary positive electrode material, leading to quality issues and reduced cutting efficiency.
Innovation Solution
A laser cutting method that involves removing active materials from the surface of the positive plate using laser irradiation or chemical agents, followed by layered cutting with lasers of varying energy densities to avoid splashing and ensure high cutting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is performed directly on the positive plate without removing active material, then cutting speed is maintained, but material splashing occurs seriously and cutting quality deteriorates
Solution Approach 1:
The patent applies preliminary action by removing the active material layer from the positive plate surface before performing laser cutting. This pre-treatment step eliminates the source of splashing and bead formation, allowing subsequent cutting to proceed without quality deterioration while maintaining high cutting speed.
2Manufacturing precision
If laser irradiation is used to remove active material before cutting, then material splashing is prevented, but process time increases
Solution Approach 1:
The patent merges the active material removal and cutting operations into a single integrated laser process. By optimizing laser parameters, the system performs both functions simultaneously, eliminating the need for separate processing steps and avoiding additional time loss while maintaining cutting quality.
3Productivity
If high energy density laser is used for cutting, then cutting efficiency is high, but violent reduction reactions occur causing severe material splashing
Solution Approach 1:
The patent extracts and removes the active material layer that contains the aluminum powder before cutting. By taking out this reactive component, the violent reduction reactions between aluminum and lithium ion are prevented, allowing high energy density laser cutting to proceed without generating harmful material splashing while maintaining cutting efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents material splashing, maintains the quality of the positive plate, and enhances cutting efficiency by controlling the reduction reactions and energy densities during the cutting process.
Implementation Method 1
performing laser irradiation on a preset position of the to-be-cut part to remove the active material on the surface of the to-be-cut part
Implementation Method 2
performing laser cutting on the to-be-cut part at the preset position to cut off the to-be-cut part
Data Source
Figure 1~2
Figure 3~4
AI summary
The present disclosure discloses a laser cutting method, which relates to the technical field of laser cutting. The laser cutting method first removes the active material on the surface of a preset position of a to-be-cut part; and then performs the laser cutting on the to-be-cut part at the preset position to cut off the to-be-cut part. Compared with the prior art, since the laser cutting method provided by the present disclosure performs the step of removing the active material on the surface of the preset position of the to-be-cut part, the quality of the to-be-cut part can be guaranteed, the occurrence of material splashing can be avoided, the steps are simple, and the cutting efficiency is higher.