Positive Resist Composition for High-Resolution Lithography
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Solution Overview
Problem
As lithography techniques advance and miniaturization of resist patterns progresses, there is a need for improved resist materials with enhanced resolution, sensitivity, and pattern shape, which existing materials fail to adequately address.
Innovation Solution
A positive resist composition is developed, comprising a polymeric compound with structural units containing an aromatic group, an acid-dissociable, dissolution-inhibiting group, and a lactone structure, which increases solubility in an alkali developing solution upon exposure, allowing for precise pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist materials are used, then existing lithography processes can be maintained, but resolution, sensitivity, and pattern shape properties cannot be sufficiently improved for further miniaturization
Solution Approach 1:
The patent modifies the chemical structure of the base resin by incorporating specific structural units (aromatic groups, acid-dissociable groups, and ester groups) to change the solubility parameters and acid sensitivity of the resist material, enabling improved resolution and sensitivity for further miniaturization
Solution Approach 2:
The patent creates a composite resist system by combining the specially designed base resin with an acid generator and other additives, forming a multi-component chemically amplified resist composition that achieves superior lithography properties for advanced miniaturization
2Reliability
If the solubility of the base resin in alkali developing solution is increased to improve sensitivity, then pattern formation sensitivity improves, but adhesion between resist film and substrate may deteriorate
Solution Approach 1:
The patent introduces different functional groups at specific locations within the resin molecule: aromatic groups and carboxyl groups for adhesion to substrate, and ester groups with acid-dissociable structures for controlled solubility enhancement in exposed regions, achieving both strong adhesion and high sensitivity simultaneously
Solution Approach 2:
The patent carefully controls the solubility parameters of the base resin by selecting specific ester groups and acid-dissociable structures, ensuring that the resin maintains adequate adhesion in unexposed regions while achieving sufficient solubility enhancement in exposed regions for high sensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition exhibits excellent lithography properties, enabling the formation of high-resolution, sensitive, and well-defined patterns with improved adhesion and etching resistance.
Implementation Method 1
an acid generator which generates acid upon exposure
Implementation Method 2
a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid
Data Source
AI summary
A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid, and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) having an aromatic group, a structural unit (a5) represented by general formula (a5-1) shown below, and a structural unit (a1) containing an acid-dissociable, dissolution-inhibiting group. In the formula (a5-1), R1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, R2 represents a divalent linking group, and R3 represents a cyclic group containing —SO2— within the ring skeleton thereof.