Positive Resist Composition with Polycyclic Aromatic Skeleton

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current resist compositions face challenges in achieving high sensitivity, high resolution, excellent pattern profile, and small line edge roughness (LER) while maintaining good dry etching resistance, particularly when forming fine patterns using electron beams or extreme ultraviolet rays, especially on substrates with light-shielding films containing heavy atoms.

Innovation Solution

A positive resist composition incorporating a polymer compound with a specific acid-decomposable acetal structure, where a hydrogen atom of a phenolic hydroxyl group is replaced by an acid labile group, enhancing dry etching resistance and sensitivity through efficient acid generation and secondary electron acquisition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the film thickness is reduced to form ultrafine patterns, then the pattern collapse problem is prevented, but the dry etching resistance deteriorates

Engineering Contradiction:
Improvepattern finenessVSAvoiddry etching resistance
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent changes the chemical composition parameters of the resist film by introducing a polycyclic aromatic skeleton structure (naphthalene or anthracene) with specific molecular weight and structural characteristics. This structural modification enables the film to maintain adequate dry etching resistance even at reduced thicknesses of 50 nm or less, while still achieving ultrafine pattern formation capability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite resin system combining polycyclic aromatic compounds (naphthalene or anthracene derivatives) with specific functional groups. This composite structure integrates both the thin-film formation capability and enhanced dry etching resistance in a single resist material, resolving the contradiction between film thickness reduction and etching resistance maintenance.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If the accelerating voltage of the electron beam is increased to reduce forward scattering, then the pattern resolution improves, but the electron energy trapping ratio decreases and back scattering increases

Engineering Contradiction:
Improvepattern resolutionVSAvoidback scattering effect
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful back-scattering effect into a beneficial outcome by using the polycyclic aromatic skeleton structure to trap back-scattered electrons. The unique electronic structure of naphthalene or anthracene derivatives captures these electrons, preventing them from causing resolution degradation, thereby transforming a harmful phenomenon into a neutral or beneficial effect.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent modifies the electronic and structural parameters of the resist material by incorporating polycyclic aromatic skeletons, which alter the electron interaction characteristics. This changes the energy trapping mechanism to be more effective at higher accelerating voltages, maintaining resolution while mitigating back-scattering damage.

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If a light-shielding film containing heavy atoms is used in photomask blanks, then the light shielding performance improves, but the back scattering effect increases significantly

Engineering Contradiction:
Improvelight shielding performanceVSAvoidback scattering
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The patent applies the same principle of converting harm into benefit for photomask applications. The polycyclic aromatic skeleton structure in the resist coating on photomask blanks captures back-scattered electrons from the heavy atom light-shielding layer, transforming the harmful back-scattering effect into a controlled phenomenon that does not degrade isolated pattern resolution.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

4Manufacturing precision

If conventional resins are used for thin film formation, then the sensitivity decreases, but the pattern profile and line edge roughness deteriorate

Engineering Contradiction:
Improvepattern profile and LERVSAvoidsensitivity
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent fundamentally changes the chemical and structural parameters of the resist material by using polycyclic aromatic skeletons with specific molecular weights and functional group configurations. This structural transformation simultaneously improves sensitivity, pattern profile, and line edge roughness characteristics, breaking the conventional trade-off between these parameters.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves high sensitivity, high resolution, excellent pattern profile, and small line edge roughness (LER) along with good dry etching resistance, effectively addressing the limitations of existing technologies in microfabrication and nanoimprint mold structures.

Implementation Method 1

a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation

Methodology Applied
Scientific EffectPhotoacid generation: Photodissociation

Implementation Method 2

exposure using an electron beam or an extreme ultraviolet ray

Methodology Applied
Scientific EffectElectron beam irradiation: Electron Beam

Implementation Method 3

the effect of electron scattering (forward scattering) in the resist film

Methodology Applied
Scientific EffectElectron scattering: Scattering

Data Source

PatentEP2707776B1Positive resist composition, and resist film, resist-coated mask blank and resist pattern forming method each using the composition
Publication Date: 2017.07.19 FUJIFILM CORP
  • EP2707776B1 patent drawing
  • EP2707776B1 patent drawing
  • EP2707776B1 patent drawing

AI summary

A positive resist composition contains: (A) a polymer compound having a structure where a hydrogen atom of a phenolic hydroxyl group is replaced by an acid labile group represented by the following formula (I): wherein R represents a monovalent organic group; A represents a group having a polycyclic hydrocarbon ring structure or a group having a polycyclic heterocyclic structure; and * represents a bonding position to an oxygen atom of the phenolic hydroxyl group.