POSS-Modified Siloxane Resin for Optical Encapsulation
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Solution Overview
Problem
Existing encapsulating materials for optical devices, such as OLEDs and LEDs, face challenges with solvent-based processes, poor compatibility with siloxane resins, and outgassing issues that degrade barrier properties, especially in thick film applications.
Innovation Solution
A resin composition combining polyhedral oligomeric silsesquioxane (POSS) and organic polysilazane, enhancing compatibility and cross-linking density, allowing for a solvent-free process and reducing outgassing through a thermosetting reaction, which improves mechanical and barrier properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a powder-type silsesquoxane with mixed structure is used to improve physical properties, then mechanical strength is enhanced, but it is incompatible with solvent-free processes required for most optical devices
Solution Approach 1:
The invention changes the physical state parameter of silsesquoxane from powder to solubilized form in siloxane resin, enabling solvent-free processing while maintaining the protective benefits of silsesquoxane structure
Solution Approach 2:
The invention creates a composite material system combining siloxane resin with silsesquoxane and silazane compounds, achieving both mechanical strength and processability in a single encapsulating composition
2Use of energy by moving object
If silazane is used to enhance adhesive strengths and barrier properties, then bonding performance improves, but severe outgassing occurs in thick film applications degrading barrier properties
Solution Approach 1:
The invention applies silazane compound locally at the interface between encapsulating material and optical device to enhance adhesion, while controlling its concentration to prevent excessive outgassing in the bulk thick film material
Solution Approach 2:
The invention optimizes the concentration parameter of silazane compound within specific ranges (0.1-10 wt% for cage-type POSS, 0.1-15 wt% for ladder-type POSS) to balance adhesive strength enhancement with outgassing suppression in thick film applications
3Reliability
If metal or glass is used to protect optical devices from oxygen and water vapors, then barrier performance improves, but flexibility and transparency are lost
Solution Approach 1:
The invention uses a flexible polymer-based encapsulating composition that can be applied as thin films, providing barrier protection while maintaining flexibility and transparency required for modern optical devices like OLEDs and flexible displays
Solution Approach 2:
The invention creates a composite polymer system combining siloxane resin with silsesquoxane and silazane compounds to achieve enhanced barrier performance against oxygen and water vapors while maintaining the flexibility and optical transparency of polymer materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables effective encapsulation of optical devices with improved mechanical properties, enhanced barrier performance, and solvent-free processing, suitable for both thin and thick films, extending the lifespan of devices like LEDs.
Implementation Method 1
a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability
Implementation Method 2
enables thermosetting process by including an organic polysilazane compound and a modified polysilazane compound, through which outgassing phenomenon can be significantly improved by eliminating unreacted monomers
Data Source
AI summary
The present invention relates to a resin composition for encapsulating an optical device and more particularly, the resin composition for encapsulating optical device of the invention comprising a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability and an organic polysilazane compound has excellent mechanical properties, and enhanced adhesive strengths to a base material and barrier properties against moisture or oxygen by having excellent solubility with siloxane resins and significantly improved outgassing phenomenon, thus being able to be applied to encapsulation process for various optical devices, especially the encapsulation process of thick films.