Post Assembly Sliding Tile Attachment for Thermal Protection
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Solution Overview
Problem
Current thermal protection systems (TPS) for vehicles are labor-intensive to install and maintain, with limited access to underlying subsystems, and require expensive polyimide structures to withstand high temperatures, preventing quick inspection and replacement of tiles.
Innovation Solution
A mechanical attachment system with a post assembly that allows tiles to slide relative to the substructure, creating a cooling gap for improved cooling and using lower-cost epoxy composite structures, facilitating rapid inspection and replacement, and enabling operation at higher temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding with SIP is used to attach TPS tiles to substructure, then thermal protection is achieved, but installation and maintenance become extremely labor-intensive and time-consuming
Solution Approach 1:
The attachment system is divided into separate modular components: a rigid attachment element that bonds to the substructure, a flexible intermediate layer (SIP), and the TPS tile. This segmentation allows each component to be optimized independently and facilitates rapid assembly and disassembly, dramatically reducing installation and maintenance time while maintaining thermal protection reliability
Solution Approach 2:
The system incorporates a flexible intermediate layer (SIP) that provides dynamic adaptability, allowing the rigid attachment element and tile to accommodate substructure deflections and thermal expansion without compromising the bond. This dynamic flexibility enables rapid installation while ensuring reliable thermal protection under varying operational conditions
2Reliability
If RTV silicone adhesive is used for bonding, then tile attachment is achieved, but access to underlying subsystems is limited and replacement requires lengthy processes
Solution Approach 1:
The attachment system separates the permanent substructure bonding function (rigid attachment element with RTV adhesive) from the replaceable tile function (connected via flexible SIP layer). This segmentation enables quick tile removal and replacement without disturbing the substructure bonds, greatly improving ease of repair and access to underlying subsystems while maintaining reliable tile attachment
Solution Approach 2:
The flexible intermediate layer (SIP) acts as an intermediary between the permanently bonded rigid attachment element and the replaceable tile. This intermediary layer allows the tile to be easily detached and reattached while the rigid element remains firmly bonded to the substructure, facilitating rapid maintenance access without compromising attachment reliability
3Temperature
If cooling gaps are created between tiles and substructure, then cooling capacity is improved, but structural support and thermal protection may be compromised
Solution Approach 1:
The system separates the structural support function (performed by the rigid attachment element bonded to substructure) from the thermal protection function (performed by the TPS tile). This segmentation allows cooling gaps to be introduced between the tile and substructure for improved cooling, while the rigid attachment element maintains structural support, preventing the gap from compromising overall reliability
Solution Approach 2:
The flexible intermediate layer (SIP) acts as an intermediary that bridges the cooling gap between the TPS tile and substructure. It maintains thermal protection and structural support functions while allowing the gap to exist for cooling purposes, thus enabling improved temperature management without sacrificing reliability
4Temperature
If polyimide structures are used to withstand high temperatures, then thermal resistance is achieved, but cost increases significantly
Solution Approach 1:
The system segments the thermal management functions: the rigid attachment element (which can use lower-cost materials) provides structural support and thermal resistance to the substructure, while the TPS tile provides the primary thermal protection. This segmentation allows lower-cost materials to be used in the attachment system while maintaining adequate thermal resistance, significantly reducing overall cost
Solution Approach 2:
The flexible intermediate layer (SIP) acts as a thermal intermediary that protects the rigid attachment element from extreme temperatures. This allows the use of lower-cost materials in the attachment system while maintaining thermal resistance through the combined SIP-attachment element-tile system, reducing manufacturing cost while preserving thermal protection capability
Data Source
AI summary
An attachment system for mounting a tile of a thermal protection system to a substructure includes a post assembly configured to interconnect the tile to the substructure. The post assembly may allow relative sliding movement between the tile and the substructure along a plane which is generally parallel to the tile. The attachment system facilitates installation and removal of the tile from the substructure for inspection, maintenance, and repair of the tile and/or the substructure.