Post-Wall Interconnect Substrate for Verifiable Via Connections
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Solution Overview
Problem
The existing post-wall waveguide technology faces challenges in ensuring reliable electrical connections between via interconnects and pads, making it difficult to detect cracks or breakages, which can occur at these interfaces.
Innovation Solution
The interconnect substrate incorporates a post-wall waveguide design with columnar portions formed by stacking pads and via interconnects, arranged at intervals to transmit electromagnetic waves. Each post wall includes connecting pads that contact insulating layers and connect multiple via interconnects, enhancing the structural integrity and reliability of the connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via interconnects and pads are formed without electrical connection in post-wall waveguide, then electromagnetic wave confinement is achieved, but electrical connection reliability cannot be verified
Solution Approach 1:
The post wall is segmented into multiple via interconnects (first, second, third via interconnects) with connecting pads positioned between them. This segmentation allows individual via interconnects to be electrically connected through the connecting pad, enabling separate electrical verification of each connection point while maintaining the overall waveguide structure.
Solution Approach 2:
A connecting pad is introduced as an intermediary element between via interconnects to establish electrical connections. This connecting pad serves as a mediator that enables current flow between adjacent via interconnects, allowing electrical continuity to be verified without compromising the electromagnetic wave confinement function of the post-wall waveguide.
2Strength
If multiple via interconnects are stacked to form columnar portions, then post-wall waveguide structure is created, but connection strength between via interconnects and pads decreases
Solution Approach 1:
Multiple via interconnects (first, second, third via interconnects) are merged through the connecting pad to form a unified columnar portion. The connecting pad combines these separate via interconnects into a single structural unit, increasing connection strength while maintaining the multi-via configuration for electromagnetic wave transmission.
Solution Approach 2:
The connecting pad is formed in advance between the via interconnects to establish electrical connections before the complete post-wall waveguide assembly is finalized. This preliminary action ensures that electrical continuity is pre-established, allowing for earlier verification and reducing the risk of connection failures in the final assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inclusion of connecting pads disperses stress, increases the connection strength between via interconnects and pads, and improves the overall reliability of the post-wall waveguide, effectively addressing the challenge of detecting defects in the electrical connections.
Implementation Method 1
a post-wall waveguide is constituted at least by the two conductors, the first post wall, and the second post wall, which surround and define a zone that serves as an electromagnetic wave transmission path
Data Source
AI summary
An interconnect substrate includes n insulating layers (n≥2), two opposing conductors arranged across the n insulating layers, and first and second post-walls each connecting the two a conductors, wherein post-wall waveguide is constituted at least by the two conductors and the first and second post-walls, which define a zone serving as a transmission path, wherein each of the first and second post-walls includes columnar portions each made by stacking pads and via interconnects penetrating the insulating layers, each pad being positioned between two vertically adjacent via interconnects, the columnar portions being arranged at a predetermined interval along a first direction for transmitting electromagnetic waves, and wherein in each of the first and second post-walls, the pads include two or more connecting pads, each being arranged in contact with an m-th insulating layer (1≤m≤n−1) and connecting two or more via interconnects arrayed along the first direction in the m-th insulating layer.