Partially Potted Circuit Board with Barrier for Welding Systems
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Solution Overview
Problem
Existing welding type systems face inefficiencies in potting printed circuit boards, leading to excessive use of potting compound, increased costs, and limited flexibility in component placement, as they often require the entire board to be potted or use methods that are limited by the size and shape of components.
Innovation Solution
A partially potted circuit board design is implemented, where a potting barrier is affixed to the board to contain potting compound in specific areas, allowing for selective and deep potting with minimal material usage, and the potting barrier can be affixed using mechanical fasteners and adhesives, enabling components to be mounted within and outside the enclosed airflow space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire circuit board assembly is placed in a shell or cup and potted up to a specified level, then environmental protection and component isolation are improved, but the cost increases significantly due to excessive use of potting compound
Solution Approach 1:
The circuit board is divided into multiple zones using barriers: a first barrier creates a first zone with components requiring environmental protection, while a second barrier creates a second zone with components exposed to airflow for cooling. This segmentation allows selective potting of only the necessary areas, reducing overall potting compound usage while maintaining protection where needed.
Solution Approach 2:
Different regions of the circuit board are assigned different environmental protection levels based on component requirements. Power components generating heat are exposed to airflow, while sensitive electronic components are protected within potted zones. This local differentiation optimizes both protection and thermal management while minimizing material consumption.
2Quantity of substance
If selective potting is used to protect only certain components, then the cost and weight are reduced, but the depth of potting is limited by the bead height of the damming material
Solution Approach 1:
Rigid or semi-rigid barriers are introduced as intermediary structures to contain the potting compound. These barriers act as formers that enable deep potting of components without relying on the height limitations of damming materials. The barriers provide structural containment allowing the potting compound to be applied to full depth of required components.
3Quantity of substance
If a 5-sided cup with pre-potted components is used, then the amount of potting compound is reduced, but the method is limited to thru-hole components and requires specific component placement
Solution Approach 1:
The circuit board design accommodates multiple component types (thru-hole, surface mount, power, sensitive electronics) within a single unified structure. The barrier system and selective potting method work universally across different component technologies and mounting styles, eliminating the need for component-specific fixtures or placement constraints.
4Reliability
If the entire circuit card is placed in a shell for potting, then environmental sealing is improved, but the cost and potting compound usage increase unnecessarily for low-voltage control circuitry
Solution Approach 1:
Environmental protection is applied locally only to high-voltage power components and sensitive electronics within designated zones on the circuit board. Low-voltage control circuitry areas are left exposed to airflow. This differentiated approach provides necessary protection where required while eliminating unnecessary cost and material usage for less sensitive components.
Data Source
AI summary
A method and apparatus for providing welding type power is disclosed. At least one circuit board is used that is partially potted using a potting barrier affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.