Potting Enclosure Fill Control Element Sealant Volume
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Solution Overview
Problem
The existing methods for potting electronic devices, such as printed circuit boards, are inefficient and costly due to excessive use of packaging materials, which leads to waste and increased expenses.
Innovation Solution
A method and apparatus that utilize an enclosure with a fill control element to reduce the amount of sealant required, by trapping air within the fill control element's inner volume, thereby minimizing the volume of sealant needed to encapsulate the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional potting method is used to seal electronic device from environment, then device is protected from environmental elements, but excessive packaging material is wasted
Solution Approach 1:
The patent applies preliminary action by placing a support structure inside the enclosure before filling it with sealant. This support structure pre-defines the fill volume and prevents over-filling, thereby reducing material waste while ensuring adequate protection of the electronic device from environmental elements
Solution Approach 2:
The support structure acts as an intermediary element between the electronic device and the sealant. It controls the sealant distribution and volume, ensuring that the minimum necessary amount of sealant is used to achieve proper protection without excessive material consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the amount of sealant used in the potting process, making it more efficient and cost-effective while ensuring the electronic device is adequately protected from environmental elements.
Implementation Method 1
filling a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, with a sealant such that air is trapped within at least a first portion of the second inner volume
Data Source
AI summary
Method and apparatus for potting an electronic device. In one embodiment, the method comprises providing an enclosure having a first inner volume with the electronic device disposed therein; placing a fill control element within the enclosure such that a second inner volume of the fill control element is fluidly coupled to the first inner volume; and filling a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, with a sealant such that air is trapped within at least a first portion of the second inner volume.