Potting Frame Optoelectronic Package for Thermal Bond Reliability
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Solution Overview
Problem
Existing optoelectronic components face reliability issues due to adhesive bonds between optical elements and optic carriers, which fail under thermal stress, leading to potential detachment and loss of functionality.
Innovation Solution
The use of a potting material to create a material bond between the optical element, optic carrier, and chip carrier, securing the optical element and optic carrier to the chip carrier, thereby enhancing component reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive bonds are used to attach optical elements to optic carriers, then the component structure is simple and easy to manufacture, but the reliability deteriorates due to thermal expansion mismatches causing adhesion degradation and potential detachment
Solution Approach 1:
The patent replaces the adhesive bonding system with a mechanical anchoring system. The optical element is fixed to the optic carrier by means of a recess in the optic carrier that receives a corresponding protrusion of the optical element, creating a form-fit connection. This mechanical substitution eliminates the reliance on adhesive bonds that fail due to thermal expansion mismatches, while maintaining ease of manufacture through simple geometric features.
Solution Approach 2:
The patent transitions from a two-dimensional adhesive bond interface to a three-dimensional mechanical interlock. The recess and protrusion create a volumetric engagement that provides mechanical strength and resistance to detachment forces, moving beyond the planar adhesive interface that is susceptible to thermal stress degradation.
2Reliability
If additional safety mechanisms are added to prevent component detachment, then the reliability improves, but the device complexity increases
Solution Approach 1:
The patent merges the fixing function directly into the optical element and carrier structures themselves. The recess and protrusion are integral parts of the optic carrier and optical element, combining the structural and fixing functions into a unified design. This eliminates the need for separate safety mechanisms while maintaining reliability through the inherent mechanical interlock.
Solution Approach 2:
The optical element and optic carrier are designed to self-anchor through their geometric features. The recess and protrusion automatically provide mechanical retention without requiring additional components or complex assembly steps. The structure serves its own fixing function, eliminating the need for external safety mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The potting material stabilizes the optical element and optic carrier, reducing the risk of detachment and improving the overall reliability and mechanical robustness of the optoelectronic component.
Implementation Method 1
The optoelectronic component employs a potting material to create a material bond between the optical element, optic carrier, and chip carrier
Implementation Method 2
features tilted side surfaces of the optical element for enhanced fixation
Data Source
AI summary
In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, an optical element and a chip carrier, wherein the semiconductor chip is arranged on the chip carrier, wherein the optical element is arranged downstream of the semiconductor chip in a radiation direction and is attached to an optic carrier by an adhesive layer, wherein a potting forms a frame around the optical element, the optic carrier and the adhesive layer which extends from the optical element to the optic carrier, wherein the potting fixes the optical element in its position relative to the semiconductor chip, wherein the optic carrier and the chip carrier are one piece, and wherein the optic carrier at least partially surrounds the semiconductor chip laterally as seen in the radiation direction.