Thermal Conductive Potting Layer for Power Supply Heat Dissipation
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Solution Overview
Problem
High-power outdoor illumination systems face challenges with heat dissipation, requiring numerous thermal pads that increase material costs and are difficult to assemble correctly, leading to misplacement issues and increased mold and processing costs due to the need for customized cooling solutions for irregularly shaped electronic components.
Innovation Solution
A power supply device with a thermal conductive potting layer on a bottom plate, where electronic components on a printed circuit board are partially immersed, allowing heat to be conducted to a heat sink for natural dissipation, reducing material costs and eliminating the need for separate cooling tanks and thermal pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal pads are used for heat dissipation between electronic components and housing, then heat conduction is achieved, but material costs increase and assembly complexity increases due to misplacement and missing issues
Solution Approach 1:
The patent combines the thermal pad function with the potting layer into a single integrated structure. The potting layer simultaneously provides thermal conduction, component fixation, and protection, eliminating the need for separate thermal pads and reducing assembly steps while preventing misplacement and missing issues
Solution Approach 2:
The potting layer is designed to perform multiple functions: thermal conduction, mechanical fixation of components, structural protection, and insulation. This multi-functional design replaces multiple separate components (thermal pads, adhesives, protective coatings) with a single universal solution
2Temperature
If thermal pads are used for heat dissipation, then heat conduction is achieved, but material costs increase due to large number of thermal pads required
Solution Approach 1:
The patent merges the thermal pad function into the potting layer, eliminating the need for separate thermal pad materials. This integration significantly reduces material quantity and cost while maintaining effective heat dissipation through the combined potting layer structure
3Temperature
If customized cooling tanks are provided for irregularly shaped electronic components, then local heat dissipation is achieved, but mold costs and processing costs increase due to inability to unify model
Solution Approach 1:
The patent employs a universal potting layer formulation that can adapt to various component shapes and sizes without requiring customized cooling tanks. The same potting layer recipe and application process works for all component types, enabling standardized manufacturing and reducing mold and processing costs
4Temperature
If thermal pads are used for heat dissipation, then heat conduction is achieved, but assembly difficulty increases due to difficulty in fixing thermal pads during assembling
Solution Approach 1:
The patent combines thermal conduction and component fixation functions into the single potting layer application process. As the potting layer cures, it simultaneously establishes thermal pathways and mechanically secures components, eliminating the separate thermal pad fixation step and simplifying assembly operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves effective natural heat dissipation while reducing material costs by 85% and simplifying assembly, standardizing the housing design, and shortening the product development cycle.
Implementation Method 1
the electronic component of the at least part of the multiple electronic components is partially immersed in the thermal conductive potting layer to conduct heat dissipated by the electronic component to the first heat sink for natural heat dissipation of the electronic component
Data Source
AI summary
The present disclosure provides a power supply device and a high-power illumination system. The power supply device includes: a housing, where the housing includes a first bottom plate having a first surface on which a first heat sink is provided and a second surface on which a thermal conductive potting layer is provided; and a printed circuit board, where the printed circuit board is located in the housing, the printed circuit board includes a circuit board body and multiple electronic components arranged on the circuit board body, at least part of the multiple electronic components is arranged facing the second surface of the first bottom plate, and the electronic component of the at least part of the multiple electronic components is partially immersed in the thermal conductive potting layer to conduct heat dissipated by the electronic component to the first heat sink for natural heat dissipation of the electronic component.