Powder ALD Chamber Knocker for Uniform Quantum Dot Coating

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Solution Overview

Problem

In the process of powder atomic layer deposition, quantum dots often stick to the inner surface of the vacuum chamber, preventing the precursor gas from forming complete and evenly-distributed thin films, which affects product yield, lifetime, and performance.

Innovation Solution

A powder-atomic-layer-deposition device with a knocker is designed, where the knocker is adjacent to the vacuum chamber to shake off powders that stick to the inner surface, ensuring they do not adhere and allowing for even film formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If quantum dots are processed in a vacuum chamber during PALD, then the deposition process can be performed, but quantum dots stick to the inner surface of the vacuum chamber preventing complete and evenly-distributed thin film formation

Engineering Contradiction:
Improvethin film uniformityVSAvoidpowder adhesion to chamber wall
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies mechanical vibration through a knocker device that periodically strikes the vacuum chamber wall to dislodge adhered quantum dots. This vibration-based approach prevents powders from sticking to the inner surface, ensuring complete and evenly-distributed thin film formation on all quantum dots without requiring changes to the PALD process itself.

Inventive Principle:
Principle #18Mechanical vibration

2Productivity

If quantum dots are secured on a carrier with adjacent dots tightly contacting, then space utilization is improved, but precursor gas cannot pass between them to form complete thin films

Engineering Contradiction:
Improvespace utilizationVSAvoidthin film completeness
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The knocker device generates mechanical vibrations that propagate through the carrier and quantum dots, creating temporary separation between tightly-contacting adjacent quantum dots. This allows precursor gas to penetrate between the dots during the PALD process, ensuring complete and evenly-distributed thin film formation while maintaining high space utilization in the carrier design.

Inventive Principle:
Principle #18Mechanical vibration

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively prevents quantum dots from sticking to the vacuum chamber, facilitating the formation of evenly-distributed thin films, thereby improving product yield and performance.

Implementation Method 1

a knocker adjacent to a front wall or a side wall of the vacuum chamber, for knocking the front wall or the side wall of the vacuum chamber

Methodology Applied
Scientific EffectVibration: Vibration

Data Source

PatentUS12123092B2Powder-atomic-layer-deposition device with knocker
Publication Date: 2024.10.22 SKYTECH
  • US12123092B2 patent drawing
  • US12123092B2 patent drawing
  • US12123092B2 patent drawing

AI summary

The present disclosure provides a powder-atomic-layer-deposition device with knocker, which mainly includes a vacuum chamber, a shaft seal, a drive unit and a knocker. The drive unit is connected to the rear wall of the vacuum chamber via the shaft seal, for driving the vacuum chamber to rotate. The shaft seal includes an outer tube and an inner tube, wherein the inner tube is disposed within the containing space of the outer tube. The inner tube is disposed with a gas-extracting pipeline and a gas-inlet pipeline therein, wherein the gas-extracting pipeline is for gas extraction of the vacuum chamber, the gas-inlet pipeline is for transferring a precursor gas into the vacuum chamber. The knocker and the vacuum chamber are adjacent to each other, for knocking the vacuum chamber to prevent powders within the reacting space from sticking to the inner surface of the vacuum chamber.