Multi-Scanner Powder Bed Laser Layout for Variable Build Areas

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Solution Overview

Problem

Existing powder additive manufacturing apparatuses face inefficiencies in processing large molding areas due to the need for moving laser light emission units, leading to potential accuracy issues and waste of laser power when processing smaller areas with multiple laser sources.

Innovation Solution

A powder-bed laser processing apparatus with multiple scanning units and drive units that allow for efficient application of laser light to various irradiation areas, with the ability to adjust the position of scanning units relative to each other, ensuring consistent laser power and effective use of multiple laser beams across different processing areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single laser light source is used for large molding area processing, then the device complexity is reduced, but the productivity decreases due to the need to move the laser light emission unit

Engineering Contradiction:
Improvenumber of laser light sourcesVSAvoidprocessing efficiency
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent divides the processing system into multiple independent scanning units (first scanning unit and second scanning unit), each with its own laser light source. This segmentation allows simultaneous processing of different areas, improving productivity while maintaining manageable device complexity through modular architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines multiple scanning units and laser light sources into a single integrated processing system. The first and second scanning units work together under unified control to process the powder bed, merging their capabilities to achieve high productivity for large molding areas while maintaining coordinated operation.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If multiple laser light sources are used to process large molding areas, then the productivity is improved, but the manufacturing precision deteriorates due to variations in laser power among different light sources

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidproduct accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent dynamically adjusts the laser power parameters of each laser light source based on real-time processing conditions and position information. By changing power parameters adaptively, the system compensates for variations among different laser sources, ensuring consistent manufacturing precision across all scanning units while maintaining high productivity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The control unit receives position information from each scanning unit and adjusts laser power parameters accordingly based on feedback. This closed-loop control ensures that each laser source operates at optimal power levels for its specific position and task, maintaining product accuracy while enabling simultaneous multi-area processing.

Inventive Principle:
Principle #23Feedback

3Productivity

If multiple laser light sources are prepared for large molding area processing, then the productivity is improved, but the loss of energy increases when processing small molding areas as some laser beams remain unused

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidwaste of laser power
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent implements dynamic selection and activation of scanning units based on the actual processing requirements. For small molding areas, only the necessary number of scanning units are activated, allowing the system to adapt its resource usage to the task at hand. This dynamic configuration minimizes energy waste from unused laser beams while maintaining high productivity when processing large areas.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The multiple scanning units and laser light sources are designed to be universally applicable across different molding area sizes. The same hardware infrastructure can efficiently process both small and large areas by selectively activating appropriate subsets of resources, eliminating the need for separate systems and reducing energy waste through versatile, adaptive operation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient processing of various molding areas by optimizing laser power distribution and utilization, improving accuracy and reducing waste, making it suitable for both large and small manufacturing tasks.

Implementation Method 1

a first scanning unit that applies first laser light to a powder bed while scanning the first laser light

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

powder additive manufacturing apparatuses, laser processing apparatuses capable of processing large molding areas

Methodology Applied
Scientific EffectSelective laser sintering: Selective Laser Sintering

Data Source

PatentUS20240181564A1Powder-bed laser processing apparatus, powder additive manufacturing apparatus, processing method, and a computer readable medium
Publication Date: 2024.06.06 THE JAPAN STEEL WORKS LTD
  • US20240181564A1 patent drawing
  • US20240181564A1 patent drawing
  • US20240181564A1 patent drawing

AI summary

A powder-bed laser processing apparatus includes a first scanning unit, a second scanning unit, a first drive unit, and a second drive unit. The first scanning unit applies first laser light to a powder bed while scanning the first laser light. The second scanning unit applies second laser light to the powder bed while scanning the second laser light. The first drive unit moves the first scanning unit so that the first laser light can be applied to a first irradiation area. The second drive unit moves the second scanning unit so that the second laser light can be applied to a second irradiation area and a position of the second scanning unit relative to the first scanning unit can be changed, the second irradiation area including a part of the first irradiation area.