Powder-Coated LED Encapsulation for Low-Reflection Panels
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Solution Overview
Problem
Conventional LED arrays used in video screens face challenges in controlling reflected light, which affects contrast and image sharpness, and there is a need for improved manufacturing efficiency and cost-effectiveness.
Innovation Solution
The use of substrate-based LEDs with underfill layers, powder-coated materials, and dark layers to control light reflection, combined with methods like grinding or sanding to expose LED surfaces for enhanced light output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent encapsulant is used to protect LEDs and maximize efficiency, then device protection and efficiency are improved, but reflected light increases reducing contrast and image sharpness
Solution Approach 1:
The patent applies different optical properties to different regions: the encapsulant is transparent in areas where light emission is needed, but dark-colored in areas where light reflection should be minimized. This local differentiation allows simultaneous achievement of device protection/efficiency and reduced reflected light for improved contrast.
2Illumination intensity
If a dark-colored encapsulant is used to reduce reflected light, then contrast and image sharpness are improved, but light output and efficiency decrease
Solution Approach 1:
The encapsulant is configured with dark-colored portions strategically positioned to reduce reflected light from specific angles or regions, while transparent portions maintain high light output and efficiency. This spatial differentiation resolves the contradiction between reducing reflected light and maintaining light output.
3Reliability
If conventional LED arrays with transparent encapsulants are used, then device protection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the protective encapsulant function with the light management function by integrating dark-colored portions directly into the encapsulant structure. This merging eliminates the need for separate protective and light-management components, thereby reducing manufacturing complexity and cost while maintaining device protection.
Data Source
AI summary
Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.