Powder Surface Coating for Uniform Conductivity in Sintered Materials
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Solution Overview
Problem
In semiconductor processing, sintered composite materials used in plasma processing chambers exhibit non-uniform electrical conductivity, leading to concentrated electric fields that impair plasma system performance and potentially damage substrates due to preferential electron conduction through conductive grain inclusions.
Innovation Solution
A method involving the chemical reduction of powder grains within a processing chamber using energetic hydrogen species to remove passivation layers, followed by atomic layer deposition of materials like yttrium oxide or transition metal oxides, creating a core-shell structure in the powders which, when sintered, results in a uniform distribution of conductive additives, reducing conductive grain inclusions and improving electrical properties at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sintered composite material is formed by sintering a blend of two or more powders, then electrical conductivity is improved, but non-uniform electrical conductivity concentrates electric field and impairs plasma system performance
Solution Approach 1:
The patent segments the conductive additive into discrete particles distributed throughout the sintered material matrix. By controlling particle size, shape, and distribution of the conductive additive segments, uniform electrical conductivity is achieved throughout the material, preventing electric field concentration while maintaining overall conductivity.
Solution Approach 2:
The patent applies local quality by creating regions with controlled concentrations of conductive additive particles. Through controlled blending and sintering processes, the distribution of conductive particles is optimized locally to ensure uniform electrical properties throughout the entire sintered material, eliminating hot spots of excessive conductivity.
2Reliability
If conductive additives are concentrated in certain regions, then electrical conductivity is enhanced, but electric field concentration damages semiconductor being processed
Solution Approach 1:
The patent achieves homogeneity by controlling the distribution of conductive additive particles to be uniform throughout the sintered material. This homogeneous distribution ensures consistent electrical conductivity across the entire material, preventing localized electric field concentration that could damage semiconductors during plasma processing.
3Reliability
If non-uniform electric fields are formed, then plasma system performance is impaired, but uniform distribution of conductive additives requires precise control
Solution Approach 1:
The patent applies preliminary action by pre-distributing conductive additive particles uniformly throughout the powder blend before sintering. This preliminary uniform distribution, achieved through controlled mixing and blending processes, ensures that the sintered material inherits this uniformity, resulting in uniform electrical conductivity and optimal plasma system performance without requiring complex post-processing control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach enhances the electrical properties of sintered materials, ensuring improved compatibility with plasma processing and reducing the impact of electric field non-uniformity, thus maintaining effective electrostatic chucking and plasma system performance.
Implementation Method 1
chemically reducing the powder through a reaction of the powder with the energetic hydrogen species
Implementation Method 2
forming a layer of material on grains of the powder within the processing region
Data Source
AI summary
Exemplary deposition methods may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include striking a first plasma in the processing region, the first plasma including energetic hydrogen species. The method may include exposing the powder to the energetic hydrogen species in the processing region. The method may include chemically reducing the powder through a reaction of the powder with the energetic hydrogen species. The method may include removing process effluents including unreacted hydrogen from the processing region. The method may also include forming a layer of material on grains of the powder within the processing region.