Powder-Pressed Cell Stack Interconnects With Low Porosity Fill Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional powder press methods for manufacturing interconnects for electrochemical cell stacks suffer from higher than desired porosity, leading to lower product yields and non-uniformity in interconnects.
Innovation Solution
A powder press apparatus and method that includes a die, punches, and a dispensing plate with apertures, allowing for independent lateral movement of the dispensing plate and base plate to control powder distribution and compaction, thereby reducing porosity and improving uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional powder press methods are used to manufacture interconnects, then the manufacturing process is simple, but the porosity is higher than desired and product yield is reduced
Solution Approach 1:
The dispensing plate is divided into multiple apertures that distribute powder into the die cavity in a controlled manner. This segmentation of the powder delivery system allows for better control over powder distribution and reduces porosity in the final interconnect product.
Solution Approach 2:
The base plate and dispensing plate are laterally moved to position the powder in the die cavity before the pressing operation begins. This preliminary positioning of powder ensures uniform distribution and proper compaction, reducing porosity before the actual pressing occurs.
2Manufacturing precision
If conventional powder press methods are used, then the equipment structure is simple, but the uniformity of interconnects is poor
Solution Approach 1:
The base plate and dispensing plate are designed to move laterally independently of each other. This dynamic positioning capability allows for precise control of powder placement and enables the system to adapt to different interconnect designs while maintaining uniformity.
Solution Approach 2:
The dispensing plate acts as an intermediary between the powder source and the die cavity. It controls the flow and distribution of powder through its apertures, ensuring uniform powder placement that leads to consistent interconnect quality.
3Manufacturing precision
If independent lateral movement of base plate and dispensing plate is implemented, then porosity is reduced and uniformity is improved, but the device complexity increases
Solution Approach 1:
The lateral movement functions of the base plate and dispensing plate are combined into a single integrated pressing apparatus. This merging of functions allows both plates to be controlled simultaneously, achieving improved porosity reduction while managing device complexity through unified control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves reduced porosity and improved uniformity in interconnects, leading to higher production yields and better electrical contact with electrochemical cells, while also reducing the complexity and cost of the pressing process.
Implementation Method 1
a fill shoe disposed over the dispensing plate at least in a fill position and configured to dispense a powder into the apertures
Implementation Method 2
pressing the powder in the die cavity to form an article
Data Source
AI summary
A powder pressing method includes laterally moving a dispensing plate and a base plate disposed under the dispensing plate from a pressing position to a dispensing position, laterally moving the base plate back to the pressing position while the dispensing plate remains in the dispensing position, such that a powder is released from apertures in the dispensing plate into a die cavity, laterally moving the dispensing plate back to the pressing position, and pressing the powder in the die cavity to form an article.