Power Adapter Thermal Structure With Air-Gap Housing Isolation
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Solution Overview
Problem
As power adapters trend towards miniaturization and high power, internal components tend to overheat due to inadequate heat dissipation, leading to potential damage and reduced service life.
Innovation Solution
A power adapter design featuring a first heat dissipation part coating the circuit board assembly with a gap between the heat dissipation part and the housing, combined with a second heat dissipation part for rapid heat transfer, and enhanced ventilation through heating vents and a heat dissipation fan, to slow down heat transfer to the housing and improve overall dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If thermally conductive potting glue or heat dissipation members are used to guide heat from internal components to the housing, then heat dissipation efficiency is improved, but the housing temperature becomes excessively high
Solution Approach 1:
The heat dissipation path is segmented into two distinct parts: a first heat dissipation part (thermally conductive) that guides heat from components to a heat dissipation assembly, and a second heat dissipation part (thermally insulating) that prevents excessive heat transfer to the housing. This segmentation allows independent optimization of heat dissipation efficiency and housing temperature control.
Solution Approach 2:
A heat dissipation assembly acts as an intermediary between the thermally conductive first heat dissipation part and the housing. This intermediary includes a thermally insulating second heat dissipation part that mediates the heat transfer process, allowing heat to be dissipated efficiently while preventing the housing from becoming excessively hot.
2Volume of moving object
If the power adapter is miniaturized, then device size is reduced, but heat dissipation becomes inadequate leading to overheating
Solution Approach 1:
Different regions of the adapter are assigned different thermal properties: the first heat dissipation part has high thermal conductivity to efficiently conduct heat away from components, while the second heat dissipation part has low thermal conductivity to control heat transfer to the housing. This local differentiation of thermal properties enables effective heat management in a compact form factor.
Solution Approach 2:
The heat dissipation system uses composite material structures with different thermal conductivities. The first heat dissipation part uses thermally conductive materials (such as thermally conductive glue or metal sheets), while the second heat dissipation part uses thermally insulating materials, creating a composite heat dissipation structure that optimizes both heat transfer and temperature control in a miniaturized design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces housing temperature, enhances reliability and safety, and prolongs the service life of the power adapter by implementing thermal resistance and targeted heat dissipation.
Implementation Method 1
there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing, so that an air layer is formed between the first heat dissipation part and the housing, to increase thermal resistance between the circuit board assembly and the housing
Implementation Method 2
a second heat dissipation part is disposed on the outer wall of the first heat dissipation part, and an end that is of the second heat dissipation part and that faces away from the first heat dissipation part is close to the inner wall of the housing or abuts against the inner wall of the housing
Implementation Method 3
a first heating vent and a second heating vent that connect the inside and the outside of the housing are disposed in the housing, so that air can circulate between the inside and the outside of the housing, to accelerate dissipation of internal heat of the power adapter
Data Source
AI summary
A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.