Multi-Path Power Amplifier Package With External Power Splitter

Solution Overview

Problem

Conventional Doherty power amplifier architectures face challenges in high efficiency operation at higher frequencies and reduced size, particularly in semiconductor package design for cellular base station transmitters.

Innovation Solution

A multiple-stage, multiple-path power amplifier design where the power splitter is external to the packaged semiconductor device, integrating the driver, carrier, and peaking amplifiers within the package, while using an external power splitter to reduce size and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the power splitter is integrated within the packaged semiconductor device, then the amplifier maintains high efficiency operation, but the device size and cost increase

Engineering Contradiction:

Improveamplifier efficiencyVSAvoidpackage size

Core Design Contradiction:

Loss of energyVSVolume of moving object

Solution Approach 1:

The amplifier is divided into integrated components (driver amplifier die, carrier amplifier die, peaking amplifier die) and external components (power splitter, output combiner). This segmentation allows the critical amplification stages to be integrated for efficiency while the passive power distribution components are externalized to reduce package size and cost.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The power splitter and output combiner are extracted from the packaged semiconductor device and placed externally. This extraction removes the bulk of the passive components that contribute most to package size and cost, while retaining the active amplification components that are essential for high efficiency operation.

Inventive Principle:

Principle #2Taking out (Extraction)

2Loss of energy

If the power splitter is integrated within the packaged semiconductor device, then the amplifier maintains high efficiency operation, but the manufacturing cost increases

Engineering Contradiction:

Improveamplifier efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The amplifier is divided into integrated components (driver amplifier die, carrier amplifier die, peaking amplifier die) and external components (power splitter, output combiner). This segmentation allows the critical amplification stages to be integrated for efficiency while the passive power distribution components are externalized to reduce package size and cost.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The power splitter and output combiner are extracted from the packaged semiconductor device and placed externally. This extraction removes the bulk of the passive components that contribute most to package size and cost, while retaining the active amplification components that are essential for high efficiency operation.

Inventive Principle:

Principle #2Taking out (Extraction)

3Loss of energy

If conventional Doherty power amplifier architecture is used, then high efficiency is achieved, but the device footprint is large

Engineering Contradiction:

Improveback-off efficiencyVSAvoiddevice footprint

Core Design Contradiction:

Loss of energyVSArea of moving object

Solution Approach 1:

The amplifier is divided into integrated components (driver amplifier die, carrier amplifier die, peaking amplifier die) and external components (power splitter, output combiner). This segmentation allows the critical amplification stages to be integrated for efficiency while the passive power distribution components are externalized to reduce package size and cost.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The design moves from a planar integration approach to a hybrid three-dimensional architecture where active components are stacked in the vertical dimension within the package, while passive components are distributed in the external horizontal plane. This dimensional transition reduces the footprint area while maintaining functional performance.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250211170A1Multiple-stage multiple-path power amplifier with in-package amplifier dies and external inter-stage power splitter

Publication Date: 2025.06.26 NXP USA INC

AI summary

A packaged semiconductor device includes a substrate, an interface for signal communication with an external power splitter, and a first and second stages of a multiple-stage amplifier. The interface includes first, second, and third leads coupled to the substrate. The first amplifier stage includes a first amplifier die with a first input, a first output, and a first power transistor that functions as a driver amplifier. The second amplifier stage includes first and second amplifier paths. The first amplifier path has a second amplifier die with a second input, a second output, and a second transistor that functions as a first final stage amplifier. The second amplifier path has a third amplifier die with a third input, a third output, and a third transistor that functions as a second final stage amplifier. The first output, second input, and third input are coupled to the first, second, and third leads, respectively.