Power Amplifier Harmonic Termination for Stable Substrate Ground

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Solution Overview

Problem

Power amplifier circuits face fluctuations in substrate reference potential due to harmonic wave termination circuits being grounded, which deteriorate the performance of other circuits referencing this potential.

Innovation Solution

A power amplifier circuit design that includes a semiconductor chip and substrate with a harmonic wave termination circuit, where the circuit elements form a part of the termination circuit to reflect harmonic wave components back to the power amplifier unit, reducing the return current through the substrate and thus minimizing potential fluctuations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-generated harmful factors

If the harmonic wave termination circuit is coupled to the ground of the module substrate, then the harmonic wave components are terminated, but the reference potential of the module substrate fluctuates due to return current

Engineering Contradiction:
Improveharmonic wave componentsVSAvoidreference potential of module substrate
Core Design Contradiction:
Object-generated harmful factorsVSStability of the object's composition

Solution Approach 1:

The ground connection path is segmented into two separate paths: one for the fundamental frequency signal (through the ground terminal) and another for harmonic wave termination (through the harmonic wave termination circuit). This segmentation allows return currents to be divided, preventing them from all flowing through the module substrate ground and causing potential fluctuations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The harmonic wave termination circuit acts as an intermediary element that provides a dedicated path for harmonic wave return currents. By introducing this intermediate component, the patent creates a separate current return path that prevents harmonic-related return currents from affecting the module substrate ground potential.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-generated harmful factors

If the harmonic wave termination circuit is grounded through the module substrate, then harmonic waves are suppressed, but the performance of other circuits referencing the substrate ground deteriorates

Engineering Contradiction:
Improveharmonic wave outputVSAvoidperformance of other circuits
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The circuit ground system is segmented into functionally separate ground paths: a main ground path for the power amplifier unit and other circuits, and a separate harmonic termination path. This segmentation isolates the harmonic termination current from the main ground system, preventing degradation of other circuits while maintaining harmonic suppression functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different ground connection qualities are provided for different functions: the power amplifier unit receives a clean, stable ground reference for sensitive operations, while the harmonic wave termination circuit has its own dedicated return path optimized for handling high-frequency termination currents without interfering with other circuits.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively suppresses or reduces substrate reference potential fluctuations, enhancing the performance of other circuits by redirecting return currents and preventing harmonic wave output to the substrate, thereby maintaining circuit stability.

Implementation Method 1

The harmonic wave termination circuit reflects, to the power amplifier unit, a harmonic wave component of the amplified signal output from the power amplifier unit

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS11677358B2Power amplifier circuit
Publication Date: 2023.06.13 MURATA MFG CO LTD
  • US11677358B2 patent drawing
  • US11677358B2 patent drawing
  • US11677358B2 patent drawing

AI summary

A power amplifier circuit includes a substrate and a semiconductor chip disposed on or above the substrate. The semiconductor chip includes a power amplifier unit that amplifies an RF signal, a ground terminal to which a ground of the power amplifier unit is coupled, and a first circuit element having a first end electrically coupled to the ground terminal without any portion outside the semiconductor chip interposed therebetween, and having a second end. The substrate includes a second circuit element having a first end electrically coupled to an output of the power amplifier unit and a second end electrically coupled to the second end of the first circuit element. The first and second circuit elements constitute a harmonic wave termination circuit. The harmonic wave termination circuit reflects, to the power amplifier unit, a harmonic wave component of the amplified RF signal output from the power amplifier unit.