Power Amplifier Impedance Matching via Intermediate Housing
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Solution Overview
Problem
The high cost of using high-frequency boards in power amplifiers for mobile telecommunication systems due to their expense and the need for stable power amplification effectiveness and high operating efficiency, which is not met by standard power amplifier designs.
Innovation Solution
A power amplifier design that allows for flexible selection of an intermediate medium between power amplification matching joints and a grounding reference layer, using housing portions filled with high-frequency materials or air to achieve impedance matching without requiring expensive high-frequency boards, thereby reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-frequency boards are used to ensure stable power amplification effectiveness and high operating efficiency, then the performance of the power amplifier is improved, but the cost of the entire device increases
Solution Approach 1:
The invention divides the circuit board into multiple layers: a first circuit board layer, a first intermediate layer, and a second intermediate layer. This segmentation allows each layer to have specialized functions - the first intermediate layer provides impedance matching while the second intermediate layer provides electrical connection, enabling the use of lower-cost materials in the circuit board while maintaining high-frequency performance through the specialized intermediate layers.
Solution Approach 2:
The invention introduces intermediate layers (first intermediate layer and second intermediate layer) between the circuit board layers. These intermediate layers act as mediators that provide impedance matching and electrical connections, allowing the main circuit board to be made of lower-cost materials while still achieving the required high-frequency signal integrity and power amplification effectiveness.
2Ease of manufacture
If standard power amplifier designs are used to reduce R&D and manufacture costs, then manufacturing cost is reduced, but the operating efficiency and performance stability cannot be guaranteed
Solution Approach 1:
The invention applies local quality by making different parts of the power amplifier structure have different properties. The intermediate layers are specifically designed with particular impedance characteristics and material properties to optimize signal transmission, while other parts of the circuit board can use standard, lower-cost materials. This localized optimization maintains high operating efficiency without requiring the entire device to be built with expensive high-frequency materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable power amplification effectiveness and high operating efficiency using relatively cheap circuit board materials, reducing device costs while maintaining performance.
Implementation Method 1
using housing portions filled with high-frequency materials or air to achieve impedance matching
Data Source
AI summary
A power amplifier and a signal transmitting system using the power amplifier are disclosed. The power amplifier includes a circuit board, a power amplifier, and a structural component. The circuit board is fixed on the structural component. The power amplifier is fixed on the circuit board or the structural component. A grounding reference layer is set on the structural component. A pair of pins is set on the power amplifier. A pair of housing portions is set between the circuit board and the structural component. Overhead matching areas are set face to face with the housing portions on the circuit board respectively. Power amplification matching portions are set face to face with the reference layer on the matching areas respectively. The pins are electrically connected to the power amplification matching portions respectively.