Power Amplifier Package Embedded Input-Output Circuit
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Solution Overview
Problem
The manufacturing process of high-power and high-efficiency power amplifiers is complex and costly due to the need for stacking dielectric circuit boards and packages, which complicates the assembly and increases costs.
Innovation Solution
A method of manufacturing a power amplifier package that embeds an integrated input-output circuit within a dielectric substrate, allowing the dielectric substrate and lead frames to be disposed on the same plane, involving steps like forming power amplifier holes, printing matching network metal patterns, sintering, etching alloy, plating nickel, and attaching a heat sink, using alumina ceramic substrates and tungsten or molybdenum manganese alloys.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric circuit board and dielectric package are stacked to configure high-power and high-efficiency power amplifiers, then the power amplifier performance is improved, but the manufacturing process becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent merges the input-output circuit with the dielectric substrate by embedding the input-output circuit board into the dielectric substrate, creating an integrated structure where the circuit board and substrate form a unified package. This eliminates the need for separate stacking of dielectric circuit board and dielectric package, thereby simplifying the manufacturing process while maintaining high-power and high-efficiency performance
2Reliability
If dielectric circuit board and dielectric package are stacked to configure high-power and high-efficiency power amplifiers, then the power amplifier performance is improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple components into a single integrated package structure where the input-output circuit board is embedded within the dielectric substrate. This merging reduces the number of separate manufacturing steps and assembly operations required, thereby lowering manufacturing costs while preserving the high-performance characteristics of the power amplifier
3Ease of manufacture
If input-output circuit is embedded in dielectric substrate and power amplifier is disposed on the same plane, then the manufacturing process is simplified and costs are reduced, but the structural complexity increases
Solution Approach 1:
The patent employs a nested structure where the input-output circuit board is embedded within the dielectric substrate, creating a compact integrated package. This nesting approach consolidates multiple components into a single unified structure, simplifying the overall package configuration while enabling simplified manufacturing processes through integrated construction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs by embedding the input-output circuit and power amplifier on the same plane, enhancing efficiency and reducing the complexity of assembly.
Implementation Method 1
the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate are sintered
Implementation Method 2
the step of attaching the heat sink on the bottom surface of the dielectric circuit board
Data Source
AI summary
A method of manufacturing a power amplifier package embedded with an input-output circuit including a dielectric circuit board, a heat sink and lead frames, the method comprising: the step of preparing the dielectric circuit board including the steps of forming a power amplifier hole in which a power amplifier chip is to be disposed on a dielectric substrate, printing an input matching network metal pattern on a left side of the power amplifier hole, and printing an output matching network metal pattern on a right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; the step of preparing the lead frames by etching alloy 42 and plating nickel; and the step of attaching the heat sink on a bottom surface of the dielectric circuit board.