Power Board Layout Shielding Electrolyte From Capacitor Venting

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Solution Overview

Problem

In image forming apparatuses, the electrolyte spurted from an explosion-proof valve in an electrolytic capacitor can adhere to electric elements provided under the capacitor, potentially causing short circuits, especially when the capacitor is mounted vertically.

Innovation Solution

A plate-shaped member, such as a heatsink with a cutout or hole, is positioned between the electrolytic capacitor and electric elements, tilted to direct the spurted electrolyte away from the circuitry, ensuring it falls to a safe area without adhering to critical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the electrolytic capacitor is mounted vertically with electric elements under it, then circuit layout freedom is improved, but the risk of electrolyte adhesion to electric elements increases

Engineering Contradiction:
Improvecircuit layout freedomVSAvoidelectrolyte adhesion risk
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

A plate-shaped member is introduced as an intermediary component between the electrolytic capacitor and the electric elements. This plate intercepts the spurted electrolyte and redirects it to a safe area, preventing direct contact with the electric elements while allowing the vertical mounting configuration to be maintained.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful effect of electrolyte spurt is extracted and redirected away from the electric elements. The plate-shaped member separates the electrolyte flow path from the electric elements, taking the electrolyte out of the dangerous trajectory and directing it to a predetermined safe area.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If a deflector plate is used to guide electrolyte away from the primary circuit, then short circuit risk is reduced, but electrolyte may still flow to areas under the capacitor

Engineering Contradiction:
Improveshort circuit preventionVSAvoidelectrolyte flow to under-capacitor area
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The plate-shaped member creates a localized protection zone directly under the electrolytic capacitor. By positioning the plate between the capacitor and the electric elements, it provides targeted protection to the specific area most at risk from electrolyte spurt, while allowing other areas to maintain their original design.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents the electrolyte from adhering to electric elements, thereby avoiding short circuits and ensuring reliable operation even when electric elements are positioned under the electrolytic capacitor.

Implementation Method 1

a plate-shaped member provided between the electrolytic capacitor and the electric element in the vertical direction

Methodology Applied
Scientific EffectGravity: Gravitation

Data Source

PatentUS11842858B2Image forming apparatus
Publication Date: 2023.12.12 CANON KK
  • US11842858B2 patent drawing
  • US11842858B2 patent drawing
  • US11842858B2 patent drawing

AI summary

An image forming apparatus includes an image forming unit and a power device. The power device includes a circuit board provided to intersect a horizontal plane. The power device includes an electrolytic capacitor, an electric element, and a plate-shaped member that is provided between the electrolytic capacitor and the electric element in a vertical direction and including a first surface extending in a second direction intersecting the vertical direction. The plate-shaped member includes a cutout or a hole, and a position of at least part of an area where the cutout or the hole is formed is farther in the first direction from the mounting surface of the circuit board than a position of the electric element.