Power Bus Layer Backplane for Communication Devices
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Solution Overview
Problem
The increasing complexity of backplane designs in communications devices leads to higher design costs and maintenance challenges due to increased pin connections and complex cabling, making it difficult to manage and maintain the systems effectively.
Innovation Solution
The implementation of a power bus layer that connects boards, power modules, and fan modules using a simplified power bus structure with conductive paths for power signals, allowing for power line communications for low-bandwidth management and high-speed interfaces for service communication, thereby reducing the need for a conventional backplane and minimizing design complexity and maintenance costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more pins are used to connect boards, power supply, and fan to backplane, then communication capabilities are improved, but design complexity and cost are increased
Solution Approach 1:
The patent divides the backplane connection system into modular components: power bus bars for power distribution, dedicated signal connectors for communication signals, and separate mounting structures. This segmentation allows each component to be optimized independently, reducing overall design complexity while maintaining high communication capabilities through multiple dedicated connection paths.
Solution Approach 2:
The patent transitions from a traditional two-dimensional backplane surface mounting to a three-dimensional connection architecture using vertical bus bars and multi-layer connector arrangements. This dimensional change allows numerous pins and connections to be organized in spatial layers rather than crowded on a single plane, significantly reducing design complexity while accommodating high pin counts for enhanced communication capabilities.
2Adaptability or versatility
If more pins are used to connect boards, power supply, and fan to backplane, then communication capabilities are improved, but design cost is increased
Solution Approach 1:
The patent combines power distribution and signal communication functions into an integrated backplane architecture where power bus bars and signal connectors coexist in a unified structure. This merging eliminates the need for separate power distribution systems and signal routing systems, reducing overall design cost while supporting high pin counts for advanced communication capabilities through shared structural elements.
Solution Approach 2:
The backplane structure is designed with universal mounting patterns and standardized connector interfaces that can accommodate different numbers and types of boards, power supplies, and fans. This multi-functionality allows the same basic architecture to support varying communication capabilities without requiring complete redesign, thereby controlling design costs while enabling high adaptability.
3Adaptability or versatility
If cabling on backplane becomes more complex, then communication capabilities are improved, but maintenance difficulty is increased
Solution Approach 1:
The patent segments the cabling system into separate power bus bar connections and dedicated signal connector cables. This segmentation allows maintenance personnel to access and replace individual signal connectors without disturbing power connections or other signal paths, significantly easing maintenance difficulty while supporting complex cabling arrangements for high communication capabilities.
Solution Approach 2:
The patent extracts signal communication functions from the power distribution structure by using separate dedicated signal connectors and cables. This extraction allows signal cabling to be independently managed, tested, and replaced without affecting power supply connections, reducing maintenance difficulty while enabling complex signal routing for enhanced communication capabilities.
Data Source
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AI summary
Embodiments of the present invention disclose a communications device and a board used in the communications device. The communications device includes: a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.