Power Cable Assembly Device with Semi-Conductive Interconnection

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Solution Overview

Problem

Existing power cable assembly devices fail to efficiently equalize electric potential between power cables and fibre optic cables, risking damage to the fibre optic cable during testing or operation, especially in underwater environments where seawater flow complicates potential equalization.

Innovation Solution

A power cable assembly device featuring an extruded profiled body with semi-conductive materials on both interior and exterior surfaces, creating a chamber for the fibre optic cable with a slit for easy introduction, ensuring electrical interconnection and preventing water circulation, thus maintaining electric potential balance without damaging the fibre optic cable.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal tubing is used to provide contact between power cores and outer conductive plastic material, then electric potential equalization is achieved, but the fibre optic cable is at risk of damage during testing or operation

Engineering Contradiction:
Improveelectric potential equalizationVSAvoidfibre optic cable damage risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A semi-conductive layer is introduced as an intermediary between the power cable components and the fibre optic cable. This layer provides the necessary electrical contact for potential equalization while its semi-conductive properties prevent excessive current flow that could damage the fibre optic cable, thus mediating between the conflicting requirements of electrical connectivity and cable protection

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the electrical conductivity parameter from highly conductive (metal tubing) to semi-conductive. By using a semi-conductive layer instead of metal tubing, the electrical properties are optimized to provide sufficient contact for potential equalization while limiting current flow to safe levels, thereby protecting the fibre optic cable during testing and operation

Inventive Principle:
Principle #35Parameter changes

2Reliability

If semi-conductive material is provided throughout the entire assembly device, then electric potential equalization is improved, but manufacturing cost and material consumption increase

Engineering Contradiction:
Improveelectric potential equalizationVSAvoidsemi-conductive material consumption
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The semi-conductive material is applied locally only where electrical contact is necessary - specifically on the interior surface of the chamber and the exterior surface of the first wall - rather than throughout the entire assembly device. This localized application maintains effective potential equalization while significantly reducing material consumption and manufacturing cost

Inventive Principle:
Principle #3Local quality

3Ease of operation

If the slit is made wide for easy fibre optic cable introduction, then ease of operation improves, but mechanical stability of the assembly device decreases

Engineering Contradiction:
Improvefibre optic cable introductionVSAvoidmechanical stability
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

The slit is formed with curved surfaces rather than sharp angles, and the chamber has a rounded cross-section. This curvature allows the slit to be sufficiently wide for cable introduction while maintaining structural integrity, as curved geometries distribute stress more effectively than sharp corners

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively equalizes electric potential between power and fibre optic cables, preventing damage during testing or operation, even in seawater environments, while allowing for efficient production with reduced semi-conductive material consumption and maintaining mechanical stability and strength.

Implementation Method 1

at least a portion of said interior surface and at least a portion of said exterior surface is provided with a semi-conductive material, respectively, said interior surface and said exterior surface being electrically interconnected by said semi-conductive material

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP3097445B1A power cable assembly device and a power cable provided with such a device
Publication Date: 2019.12.25 NKT HV CABLES AB
  • EP3097445B1 patent drawingFigure 1a~1b
  • EP3097445B1 patent drawingFigure 2
  • EP3097445B1 patent drawingFigure 3a~3b

AI summary

A power cable assembly device adapted to be arranged in the spaces between neighbouring power cores of a power cable, comprises an extruded profiled body (4) made of a polymer material and adapted to the cross-sectional shape and elongation of the power cable, said profiled body (4) comprising a first wall (6), a second wall (8) and a third wall (10), said first wall (6) being convex and having first and second opposite end portions (6a, 6b), the first wall (6) having an exterior surface (102) adapted to face a jacket of the power cable,said profiled body further comprising a chamber wall (18) extending from said second wall (8) to said third wall (10), said chamber wall (18) having an interior surface (100) defining a chamber (16), said profiled body (4) defining a slit (15) between said second wall (8) and said third wall (10) to said chamber(16), said chamber (16) being adapted to receive a fibre optic cable (30) via said slit (15). According to the invention, at least a portion of said interior surface (100) and at least a portion of said exterior surface (102) is provided with a semi-conductive material (21), respectively, said interior surface (100) and said exterior surface (102) being electrically interconnected by said semi-conductive material (21).