Power Cable Adhesive Layer to Prevent Insulation Shrink Back

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Power cables experience axial movement of the insulation system relative to the conductor due to thermal shrinkage, leading to exposed conductor portions, known as shrink back, which is influenced by insulation thickness, conductor material, and extrusion procedures, necessitating alternative solutions to reduce this movement.

Innovation Solution

A power cable design featuring an adhesive layer between the conductor and the inner semiconducting layer, which restricts axial movement, comprising an inner semiconducting layer, an insulation layer, an outer semiconducting layer, and an adhesive layer that directly contacts the conductor or inner semiconducting layer, potentially using semiconductive or insulating materials like maleic-anhydride-functionalised polyolefin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the insulation system is designed with standard thickness and materials, then the cable structure is simple and manufacturing is easier, but axial movement of the insulation system relative to the conductor occurs due to thermal shrinkage, causing shrink back

Engineering Contradiction:
Improveshrink back reductionVSAvoidinsulation system structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

An adhesive layer is introduced as an intermediary component between the conductor and the inner semiconducting layer. This adhesive layer prevents axial movement of the insulation system relative to the conductor by creating a bonding interface, thereby eliminating shrink back without requiring changes to the basic insulation system structure or materials.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the insulation system is made more complex with additional layers or anchoring elements, then shrink back is reduced, but the manufacturing process becomes more difficult and costly

Engineering Contradiction:
Improveshrink back reductionVSAvoidcable manufacturing process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The adhesive layer is integrated into the existing insulation system structure, merging the function of preventing axial movement with the standard cable manufacturing process. This approach combines the adhesive bonding function with the insulation system assembly, allowing shrink back prevention to be achieved during normal manufacturing without requiring separate anchoring elements or complex additional steps.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive layer effectively reduces or eliminates shrink back by adhering the inner semiconducting layer to the conductor, enhancing the stability of the insulation system and preventing exposure of the conductor, applicable to various voltage and cable types, including submarine and land power cables.

Implementation Method 1

an adhesive layer arranged between the conductor and the inner semiconducting layer, the adhesive layer directly contacting an inner surface of the inner semiconducting layer and/or the adhesive layer directly contacting an outer surface of the conductor. The adhesive layer restricts axial movement of the inner semiconducting layer relative to the conductor.

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20240428964A1Power cable with reduced shrink back
Publication Date: 2024.12.26 NKT HV CABLES AB
  • US20240428964A1 patent drawing
  • US20240428964A1 patent drawing

AI summary

A power cable including: a conductor, an insulation system including: an inner semiconducting layer arranged radially outside the conductor, an insulation layer arranged radially outside the inner semiconducting layer, and an outer semiconducting layer arranged radially outside the insulation layer, and an adhesive layer arranged between the conductor and the inner semiconducting layer, the adhesive layer directly contacting an inner surface of the inner semiconducting layer and/or the adhesive layer directly contacting an outer surface of the conductor.