Power Module Connection Capacitor Layout for Low Inductance Cooling
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Solution Overview
Problem
The inductance and temperature increase in conductors connecting capacitor elements and power modules in power conversion devices, particularly due to high voltage, large current capacity, and high-frequency switching, are not adequately addressed by existing technologies.
Innovation Solution
A power module connection capacitor design featuring a housing with capacitor elements, positive and negative electrode conductors, insulation portions, and a conductive plate made of high-heat conductivity material, integrated with a cooler to reduce inductance and temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the bus bar connects the capacitor cell and the power module to handle high voltage and large current, then the current carrying capacity is improved, but the inductance in the current path increases and temperature rises
Solution Approach 1:
A conductive plate is introduced as an intermediary component between the positive electrode conductor and negative electrode conductor. This plate provides an alternative current path that reduces the loop area, thereby reducing inductance. The conductive plate also acts as a heat sink to dissipate temperature rise in the bus bar connection.
Solution Approach 2:
The invention changes the physical parameters of the connection structure by adding a conductive plate that alters the current distribution and reduces the effective loop area. This parameter change reduces the inductance value while maintaining the required current carrying capacity.
2Productivity
If higher voltage and larger current capacity are used to improve power conversion performance, then the productivity is improved, but the temperature of the bus bar increases
Solution Approach 1:
The conductive plate serves as a thermal intermediary by providing a low-thermal-resistance path for heat dissipation from the bus bar connection points. This mediator component helps manage the temperature rise associated with high power operation.
Solution Approach 2:
The invention converts the harmful effect of high current (which causes temperature rise) into a beneficial effect by using the same high current to create magnetic flux that induces eddy currents in the conductive plate, which in turn helps dissipate heat through controlled energy loss in the plate.
3Power
If the conductor is designed for high current capacity, then the power handling is improved, but the inductance occurrence increases
Solution Approach 1:
The conductive plate acts as a mediator that provides a parallel current path, effectively reducing the inductance of the main power handling conductors. This allows the system to maintain high power handling capability while reducing the harmful inductance effect.
Solution Approach 2:
The invention addresses the inductance problem by adding a dimensional element (the conductive plate) that creates a three-dimensional current distribution pattern. This dimensional change reduces the effective loop area and thus reduces inductance while maintaining power handling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses inductance and temperature increase in conductors, enhancing the performance and reliability of power conversion devices.
Implementation Method 1
the conductive plate is formed of a material with higher heat conductivity than the insulation portion
Implementation Method 2
the adjust member affects the magnetic flux generated by the loop current flowing through the capacitor cell, resulting in the adjustment of the inductance in the capacitor cell
Implementation Method 3
a cooler that cools the power module connection capacitor and the power modules, in which the housing is connected to the cooler
Data Source
AI summary
A capacitor according to the present disclosure is provided with: a plurality of capacitor elements arranged side by side in a housing; positive electrode conductors that each connect the positive electrode of each capacitor element with the positive electrode of a power module; negative electrode conductors that each connect the negative electrode of each capacitor element with the negative electrode of the power module while holding the plurality of capacitor elements between the positive and negative electrode conductors; insulation portions that are provided in the housing to fill spaces between the inner surfaces of the housing, the plurality of capacitor elements, the positive electrode conductors, and the negative electrode conductors and thereby insulate the same from each other; and a conductive plate that is formed from a material with higher heat conductivity than the insulation portions and that is disposed, with the intermediation of the insulation portions, between a positive electrode conductor current path extending from each capacitor element to the power module and a negative electrode conductor current path extending from each capacitor element to the power module in the housing such that the insulation portions are interposed between the positive and negative electrode conductors.