Multi-Phase Power Chip Temperature Balancing by Current Redistribution
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Solution Overview
Problem
In multi-phase power supply systems, the current controller cannot obtain individual temperature information for each power supply conversion chip, leading to potential overheating and disruption of power supply due to temperature abnormalities in a few chips.
Innovation Solution
A temperature control method where each power supply conversion chip includes an accumulator that sends a current temperature accumulation value to the controller, allowing for real-time average temperature calculation and adjustment of output currents to equalize temperatures across chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If temperature feedback ends of each power supply conversion chip are connected in parallel to a single temperature signal input end of the controller, then the controller can monitor temperature of all chips, but the controller cannot obtain individual temperature information for each chip
Solution Approach 1:
The patent segments the temperature monitoring function by providing each power supply conversion chip with its own dedicated temperature signal input end in the controller. This segmentation allows the controller to obtain individual temperature information for each chip, resolving the information loss caused by parallel connection of temperature feedback ends.
Solution Approach 2:
The patent introduces an accumulator in each power supply conversion chip as an intermediary device. The accumulator sums the current detection value and temperature detection value to generate a current temperature accumulation value, which is then transmitted to the controller. This intermediary mechanism enables individual temperature monitoring without increasing controller complexity.
2Temperature
If current equalization is controlled to ensure temperature equalization between power supply conversion chips, then temperature uniformity is maintained, but the method is only applicable to scenarios where chip arrangement positions are relatively concentrated
Solution Approach 1:
The patent applies local quality by enabling independent temperature and current control for each power supply conversion chip. The controller can adjust the output current of each chip based on its specific temperature conditions and spatial position, allowing temperature equalization across chips with different arrangement positions rather than requiring uniform current distribution.
Solution Approach 2:
The patent implements dynamic temperature control where the controller continuously monitors individual chip temperatures and adjusts output currents in real-time. This dynamic adjustment allows the system to adapt to different chip arrangement positions and thermal environments, maintaining temperature equalization regardless of whether chips are concentrated or distributed.
3Reliability
If the controller shuts down all power supply conversion chips when one chip triggers over-temperature protection, then chip damage is prevented, but normal power supply is disrupted due to temperature abnormality of a few chips
Solution Approach 1:
The patent segments the power supply system into independently controllable modules. Each power supply conversion chip can be monitored and controlled individually, allowing the controller to shut down only the specific chip that triggers over-temperature protection while keeping other chips operational. This segmentation maintains both chip protection and power supply continuity.
Solution Approach 2:
The patent implements individual feedback control for each power supply conversion chip by providing dedicated temperature and current signal input ends. The controller receives feedback from each chip independently and adjusts or shuts down only the affected chip, preventing system-wide shutdown while maintaining overall system reliability and productivity.
Data Source
AI summary
The present application relates to the field of power electronics technology control, and discloses a temperature control method for a power supply conversion chip, a related assembly, and a multi-phase power supply apparatus. A real-time average value of current temperature accumulation values of power supply conversion chips is calculated, and the output current of the power supply conversion chip whose current temperature accumulation value is not equal to the real-time average value is increased or decreased. The temperature of a power supply conversion chip increases as the output current increases and decreases as the output current decreases, and the temperature of the power supply conversion chip changes under a condition that the output current of the power supply conversion chip is adjusted.