Power Chip Package Support Structure to Prevent Tilting
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Solution Overview
Problem
Power chips in existing package structures are prone to tilting, leading to reliability issues.
Innovation Solution
A power chip package structure with a first supporting portion between the carrier and the chip, using conductive pastes to secure the chip in a preset position, and a positioning portion to maintain alignment during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power chip is directly placed on the carrier without supporting parts, then the manufacturing process is simpler, but the power chip is prone to tilting which reduces reliability
Solution Approach 1:
The patent introduces a first supporting portion as an intermediary element between the carrier and the power chip. This supporting portion includes multiple supporting parts that extend from the carrier surface to support the power chip, preventing direct contact and tilting. The intermediary structure resolves the contradiction by providing stability without requiring complex additional mechanisms.
Solution Approach 2:
The supporting parts are pre-formed on the carrier before the power chip is placed. This preliminary action ensures that the support structure is already in position to prevent tilting, eliminating the need for complex post-placement adjustment mechanisms and maintaining manufacturing simplicity.
2Manufacturing precision
If the power chip is secured without a supporting portion, then the structure is simpler, but the chip placement precision and alignment are poor
Solution Approach 1:
The first supporting portion acts as a mediator that provides both mechanical support and positioning features. The supporting parts extend upward to contact the power chip, ensuring precise placement and alignment during the bonding process without requiring complex external positioning devices.
3Reliability
If the power chip is allowed to move freely on the carrier, then the manufacturing process is easier, but the electrical connection reliability is poor due to tilting
Solution Approach 1:
The supporting portion serves as an intermediary that maintains the power chip in a stable, tilted-free position. This ensures reliable electrical connections through the conductive paste while keeping the assembly process straightforward, as the supporting structure is integrated into the carrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents tilting of the power chip during production, enhancing reliability by ensuring accurate placement and electrical coupling.
Implementation Method 1
a curing step: heating and sintering the at least one first conductive paste through the jig so that the power chip is fixed to the at least one first conductive paste
Data Source
AI summary
The present invention provides a power chip package structure and a manufacturing method thereof. The power chip package structure includes a carrier, a plurality of supporting portions, a conductive paste, and a power chip. The carrier includes a ceramic board and an inner metal layer that is formed on the ceramic board. The inner metal layer has a connection pad and a plurality of carrying regions spaced apart from each other and arranged outside of the connection pad. The supporting portions are respectively formed on the carrying regions, and the conductive paste is disposed on the connection pad. The power chip includes a chip body disposed on the supporting portions and a bonding pad that is formed on the chip body. The bonding pad is connected to the conductive paste, such that the power chip is electrically coupled to the carrier.