Power Circuit Module Thermal Management via Flexible Conduction Sheet
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Solution Overview
Problem
Existing power circuit modules face challenges in accurately and quickly detecting temperature increases in heat generating elements while efficiently dissipating heat, which can lead to overheating and damage.
Innovation Solution
A power circuit module design featuring a heat generating element, a temperature detecting element thermally and electrically connected via a flexible heat conduction sheet, and a heat dissipating body, with specific thermal resistance and heat capacity relationships to enable rapid and accurate temperature detection and dissipation, using a flexible resin multilayer electronic circuit board with improved RF characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a heat conduction sheet is used to thermally connect the heat generating element and temperature detecting element, then temperature detection accuracy is improved, but heat detection speed deteriorates due to thermal resistance
Solution Approach 1:
The patent changes the physical parameters of the heat conduction sheet by making it thinner and using materials with higher thermal conductivity. This reduces thermal resistance while maintaining thermal connection, thereby improving both temperature detection accuracy and heat detection speed simultaneously.
Solution Approach 2:
The heat conduction sheet acts as an intermediary that thermally connects the heat generating element and temperature detecting element while allowing electrical isolation. This mediator enables accurate temperature detection by conducting heat efficiently without requiring direct electrical contact between components.
2Loss of energy
If the heat dissipating body is made larger to improve heat dissipation, then heat dissipation efficiency is improved, but device size increases
Solution Approach 1:
The patent uses composite materials for the heat dissipating body, combining materials with high thermal conductivity and high specific heat capacity. This allows the heat dissipating body to be more compact while maintaining efficient heat dissipation performance, as the composite structure maximizes heat absorption and transfer per unit volume.
Solution Approach 2:
The patent optimizes the thermal parameters of the heat dissipating body by selecting materials and structures with high thermal conductivity and high specific heat capacity. These parameter changes enable the heat dissipating body to achieve better heat dissipation efficiency in a smaller volume.
3Speed
If the temperature detecting element is made closer to the heat generating element for faster detection, then detection speed is improved, but electrical isolation becomes difficult to maintain
Solution Approach 1:
The heat conduction sheet serves as an intermediary that provides both thermal connection and electrical isolation. It is positioned between the heat generating element and temperature detecting element, allowing heat to conduct through while maintaining electrical isolation. This enables the temperature detecting element to be closely positioned for fast detection without compromising electrical isolation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed, high-accuracy temperature detection and efficient heat dissipation, preventing overheating and allowing for flexible design to limit maximum heat generating element temperatures, even under varying power loss conditions, while maintaining a compact size for high-power applications.
Implementation Method 1
The temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet
Implementation Method 2
a heat dissipating body that dissipates heat of the heat generating element
Data Source
AI summary
A power circuit module includes an electronic circuit board, a heat generating element mounted on a first surface of the electronic circuit board and being a semiconductor electronic component that constitutes a part of a power circuit, a temperature detecting element that detects the temperature of the heat generating element, an electric circuit wiring, a heat dissipating body that dissipates heat of the heat generating element, and a heat conduction sheet having elasticity and flexibility, and a thickness. The heat conduction sheet is between the heat generating element and the heat dissipating body, the temperature detecting element is thermally connected to the heat generating element via the heat conduction sheet and is electrically connected via the electric circuit wiring, and with regard to the sizes of the components, the following relationship holds: temperature detecting element<heat generating element<heat dissipating body.