Power Circuit Module Pressure Plate Protrusion Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The assembly of high-power power circuit modules is complex and costly due to the need for precise pressure distribution and heat dissipation, which complicates the assembly process and increases production costs.
Innovation Solution
A power circuit module design featuring a pressure plate with a protrusion body and a frame that supports the pressure plate, allowing for even pressure transmission to the substrate through materials with different elastic moduli, reducing the risk of substrate damage and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pressure plate with protrusion body is used to transmit external force to the substrate, then the pressure distribution is improved, but the device structure becomes more complex
Solution Approach 1:
The pressure plate incorporates a protrusion body with a specific geometric shape that concentrates force application at particular locations. This local structural modification creates non-uniform pressure distribution in a controlled manner, allowing even force transmission to the substrate while maintaining overall structural simplicity.
Solution Approach 2:
The pressure plate is divided into distinct functional regions: a flat base portion for general support and a protrusion body for focused force application. This segmentation allows each part to perform its specific function optimally, simplifying the overall design while achieving uniform pressure distribution across the substrate.
2Manufacturing precision
If materials with different elastic moduli are used in the pressure plate, then the pressure transmission is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The pressure plate is constructed from materials with different elastic moduli, combining a softer material for the protrusion body that deforms to distribute pressure evenly, and a harder material for the base that provides structural support. This composite approach achieves uniform pressure transmission while keeping the manufacturing process manageable through material selection rather than complex processing.
Solution Approach 2:
By selecting materials with specific elastic modulus values for different parts of the pressure plate, the design optimizes pressure distribution characteristics. The softer protrusion body material deforms under load to create even pressure contact, while the harder base material maintains structural integrity, achieving the desired pressure transmission without complex assembly procedures.
3Stability of the object's composition
If the frame supports the pressure plate to form a closed space, then the structural stability is improved, but the assembly complexity increases
Solution Approach 1:
The frame serves multiple functions simultaneously: it provides structural support for the pressure plate, encloses the substrate to form a protected space, and contributes to the overall structural stability. This multi-functionality reduces the need for additional separate components, simplifying the assembly structure while maintaining high structural stability.
Solution Approach 2:
The frame integrates several structural functions into a single component: support for the pressure plate, enclosure for the substrate, and stability provision for the entire assembly. By merging these functions into one element, the design reduces assembly complexity while achieving the required structural stability and forming a substantially closed space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures even pressure distribution, reduces the risk of substrate damage, improves assembly efficiency, and lowers the structural cost of the power circuit module while maintaining effective thermal contact with the heat radiator.
Implementation Method 1
materials with different elastic moduli
Implementation Method 2
external force is transmitted to the substrate via the protrusion
Implementation Method 3
the frame supports the pressure plate
Data Source
AI summary
A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.