Low Profile Power Connector Cooling Slots

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

There is a need for an electrical connector assembly that can carry high current between circuit boards while maintaining a low profile and effectively dissipating heat, as existing connectors face challenges with overheating due to dense packaging and increasing current demands.

Innovation Solution

The electrical connector assembly features a plug and receptacle connector design with a dielectric plastic housing, high-strength materials, and strategically positioned cooling slots for enhanced airflow and heat dissipation, allowing for secure and reliable high-current connections between circuit boards without excessive height or space requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the connector is designed to carry high current, then the current carrying capacity is improved, but heat generation increases leading to overheating

Engineering Contradiction:
Improvecurrent carrying capacityVSAvoidconnector temperature
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by high current into a beneficial cooling effect by designing cooling apertures that channel airflow directly over the power contacts. The heat that would otherwise cause overheating is now utilized to drive convection currents through the apertures, enhancing passive cooling efficiency

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent employs airflow dynamics by creating cooling apertures that allow air to flow through the connector housing and over the power contacts. This pneumatic approach uses forced or natural convection to remove heat from the contacts, directly addressing the overheating issue while maintaining high current capacity

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Temperature

If cooling apertures are added to enhance heat dissipation, then heat dissipation is improved, but the connector profile height increases

Engineering Contradiction:
Improveheat dissipationVSAvoidconnector profile height
Core Design Contradiction:
TemperatureVSLength of stationary object

Solution Approach 1:

The patent resolves the height conflict by transitioning the cooling aperture design from a vertical dimension to a horizontal dimension. The apertures are formed as slots or openings in the side walls of the housing rather than requiring additional vertical space, allowing cooling functionality to be integrated within the existing profile height constraints

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The housing structure serves multiple functions simultaneously: it provides mechanical support, electrical insulation, and integrated cooling pathways. The cooling apertures are incorporated into the existing housing walls, which also serve as structural and insulating elements, eliminating the need for separate cooling components that would increase height

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If dense packaging is used to reduce space, then space utilization is improved, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvespace utilizationVSAvoidheat dissipation
Core Design Contradiction:
Area of stationary objectVSTemperature

Solution Approach 1:

The patent introduces air as an intermediary cooling medium that flows through the connector housing via the cooling apertures. This air flow acts as a heat transfer mediator between the power contacts and the surrounding environment, enabling effective heat dissipation even in densely packaged configurations where direct contact cooling or large heat sinks are not feasible

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient heat dissipation and reliable high-current connections between circuit boards, addressing the challenge of overheating and dense packaging by maintaining a low profile and ensuring secure, reliable power transfer.

Implementation Method 1

strategically positioned cooling slots for enhanced airflow and heat dissipation

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP1962387B1Low profile high current power connector
Publication Date: 2013.08.28 TE CONNECTIVITY CORP
  • EP1962387B1 patent drawingFigure 1
  • EP1962387B1 patent drawingFigure 2
  • EP1962387B1 patent drawingFigure 3

AI summary

An electrical connector assembly comprises a plug connector (10) and a receptacle connector (15). The plug connector includes a plug housing (11) having a plug tail section (30) and a plug shroud section and at least one plug power contact (20). The receptacle connector includes a receptacle housing (16) having a receptacle tail section and a receptacle shroud section and at least one receptacle power contact (21). The plug connector (10) and the receptacle connector (15) are configured to mate with each other by insertion of the receptacle shroud section into the plug shroud section to establish an electrical connection between the plug power contact (20) and the receptacle power contact (21). The plug housing (11) includes at least one cooling slot (50) in the plug shroud section, and the receptacle housing (16) includes at least one cooling slot (50) in the receptacle shroud section that is aligned with the at least one cooling slot in the plug shroud section to enhance cooling airflow through the plug shroud section and the receptacle shroud section when the plug connector (10) and the receptacle connector (15) are mated.