Power Connector EMI Enclosure With Flap Thermal Interface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power connectors face challenges in thermal management and EMI shielding, particularly in small enclosures where heat transfer is hindered by rigid surfaces and air gaps with low thermal conductivity, making it difficult to maintain components at different temperatures effectively.
Innovation Solution
A power connector design featuring an EMI enclosure with flaps thermally coupled to heat-generating components, providing both electromagnetic interference shielding and efficient heat dissipation through thermally conductive materials and strategically placed thermal interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If rigid surfaces of the enclosure are used, then EMI shielding is provided, but air gaps with low thermal conductivity form, inhibiting heat transfer
Solution Approach 1:
The patent employs flexible thermal interface materials (TIMs) and compliant thermal pads between heat-generating components and the enclosure surfaces. These flexible materials conform to irregular surfaces, eliminating air gaps while maintaining EMI shielding integrity through continuous conductive paths.
Solution Approach 2:
The patent introduces thermal interface materials as intermediary substances between heat-generating components and the enclosure. These materials mediate the thermal transfer by providing compliant, thermally conductive paths that bridge surface irregularities and maintain intimate contact, thus overcoming the thermal blocking effect of air gaps.
2Volume of moving object
If components are arranged in a small package, then the power connector fits within the enclosure, but thermal management becomes difficult
Solution Approach 1:
The patent utilizes multi-dimensional thermal management strategies by incorporating thermal vias, heat sinks, and cooling channels that extend in multiple directions from heat-generating components. This dimensional approach maximizes heat dissipation surface area within the constrained volume of the small package.
Solution Approach 2:
The patent implements nested thermal management structures where heat sinks, thermal pads, and cooling features are integrated within the limited space of the small package. Components are arranged in nested configurations that allow thermal paths to be embedded within structural elements, achieving effective thermal management without increasing overall package volume.
3Temperature
If contiguous surfaces of thermally conductive material are used, then heat transfer occurs readily, but the ability to maintain different temperatures in different areas is compromised
Solution Approach 1:
The patent divides the enclosure into segmented thermal zones by introducing thermal barriers, insulating partitions, and selectively positioned thermal interface materials. This segmentation allows different regions of the enclosure to maintain different temperatures while still providing overall thermal management through controlled heat transfer paths.
Solution Approach 2:
The patent applies local quality by using thermally conductive materials only where heat dissipation is needed (near heat-generating components) and thermally insulating materials in regions where temperature isolation is required. This localized approach to thermal conductivity enables both efficient heat transfer and temperature zone control within the same enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal dissipation within the power connector, maintaining component temperatures and preventing overheating while maintaining EMI shielding, thus enhancing the overall performance and reliability of the power connector.
Implementation Method 1
The first flap includes a flap thermal interface thermally coupled to the electrical component to dissipate heat from the electrical component
Implementation Method 2
The walls of the EMI enclosure provide EMI shielding for the electrical component
Data Source
AI summary
A power connector includes a housing having a front wall including a socket configured to receive a power plug. The power connector includes an electrical component held by the housing being electrically connected to a power contact in the socket. The electrical component is a heat generating component. The power connector includes an EMI enclosure coupled to the housing. The EMI enclosure has walls defining a chamber. The housing, power contacts, and electrical component are received in the chamber. The walls of the EMI enclosure provide EMI shielding for the electrical component. The EMI enclosure includes a flap extending from a wall of the EMI enclosure into the chamber having a flap thermal interface thermally coupled to the electrical component to dissipate heat from the electrical component.