Power Connector Thermal Conduction via Heat Sink Element
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Solution Overview
Problem
Power connectors in electronic devices, such as power electronic converters and motor controllers, cause thermal fatigue in printed wiring boards due to inadequate heat dissipation, leading to reduced reliability and lifespan.
Innovation Solution
A power connector assembly featuring a heat conducting connector shell and a heat conduction element within the shell, which directs heat from the connector pins to the chassis, utilizing materials like copper, aluminum, or Kovar, and a thermally conductive pad to efficiently dissipate heat away from the printed wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connector pins are soldered to plated through-holes on a PWB to conduct power, then electrical connectivity is achieved, but heat accumulates on the PWB causing thermal fatigue
Solution Approach 1:
The invention extracts the heat dissipation function from the PWB structure by introducing a separate heat conduction element that is thermally coupled to the connector pins. This element conducts heat away from the PWB, preventing heat accumulation while maintaining the electrical connectivity function of the plated through-holes.
Solution Approach 2:
The heat conduction element acts as an intermediary between the connector pins and the heat sink. It is thermally coupled to the connector pins and provides a dedicated heat conduction path to the heat sink, mediating the heat transfer process and protecting the PWB from direct thermal exposure.
2Power
If high current (20A-40A or more) is carried through connector pins to the PWB, then power delivery is achieved, but thermal fatigue damage occurs at the plated through-holes
Solution Approach 1:
The invention converts the harmful heat generated by high current flow into a manageable thermal conduction problem. By providing a dedicated heat conduction element thermally coupled to the connector pins, the heat that would otherwise cause thermal fatigue at the plated through-holes is efficiently conducted away, transforming a reliability threat into a controlled thermal management solution.
3Volume of moving object
If the PWB is positioned close to the connector pins for compact design, then device compactness is achieved, but the PWB is more susceptible to thermal damage
Solution Approach 1:
The heat conduction element serves as a thermal intermediary positioned between the connector pins and the PWB. It provides a dedicated heat escape path that is independent of the PWB's physical position, allowing the PWB to be placed close to the connector pins for compact design while still protecting it from thermal damage through the intermediary heat conduction path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the thermal fatigue life of the printed wiring board by efficiently conducting heat away from the connector pins, reducing the risk of overheating and associated damage.
Implementation Method 1
a heat conduction element arranged in the connector shell in thermal contact with the plurality of connector pins for conducting heat dissipated by the connector pins to the connector shell
Data Source
AI summary
A power connector assembly is disclosed that includes a connector shell formed from a heat conducting material, a plurality of connector pins arranged in the connector shell, and a heat conduction element arranged in the connector shell in thermal contact with the plurality of connector pins for conducting heat dissipated by the connector pins to the connector shell.