Power Control Module Common Cooling Plate Thermal Management
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Solution Overview
Problem
The challenge in producing electronics modules for power control in vehicles is the increasing miniaturization of components, which demands efficient heat dissipation in compact spaces, as existing solutions often require separate cooling plates for each power switch element, limiting overall heat dissipation efficiency.
Innovation Solution
Thermally coupling a group of power switch elements, such as MOSFETs, to a common cooling plate, with a connecting element that also connects the cooling plate to a heat sink, allowing for increased heat dissipation through a larger surface area and improved thermal conductivity, while maintaining a compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling plates are used for each power switch element, then each element can be cooled individually, but the overall heat dissipation efficiency is limited and the device complexity increases
Solution Approach 1:
The patent combines multiple separate cooling plates into a single common cooling plate that serves multiple power switch elements simultaneously. This merging approach reduces the number of cooling components needed while maintaining effective heat dissipation across all power elements, thereby reducing device complexity without sacrificing cooling performance.
Solution Approach 2:
The common cooling plate performs multiple functions by serving as the cooling interface for several different power switch elements at once. Instead of each cooling plate being dedicated to a single element, the universal cooling plate handles thermal management for the entire power element group, improving overall heat dissipation efficiency while reducing component count.
2Volume of moving object
If components are miniaturized to reduce installation space, then the module becomes more compact, but heat dissipation becomes more challenging
Solution Approach 1:
By merging multiple cooling functions into a single common cooling plate, the patent enables compact module design where multiple power elements share a unified thermal management solution. This approach allows miniaturization while maintaining adequate heat dissipation capacity through the shared cooling structure.
Solution Approach 2:
The common cooling plate extends the heat dissipation solution into the thermal conduction dimension, allowing heat from multiple compact power elements to be collected and dissipated through a single extended thermal pathway. This dimensional approach to heat management enables compact packaging while preserving heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more efficient heat dissipation than separate cooling plates, achieving a compact and efficient power control module with reduced production costs and enhanced thermal conductivity, protecting the module from environmental and mechanical damage.
Implementation Method 1
a cooling plate, that connects the first cooling surface and the second cooling surface to one another, as well as to the cooling element in a thermally conductive manner
Data Source
AI summary
The invention relates to an electronics module (100) for power control. The electronics module (100) comprises a carrier element (102), which has at least a first power switch element (104) with a first cooling surface (106) and a second power switch element (108) with a second cooling surface (110), a heat sink (126), and a cooling plate (122), which connects the first cooling surface (105) and the second cooling surface (110) to one another as well as to the heat sink (126) in a thermally conductive manner, when the electronics module (100) is installed.