Power Conversion Device Cooling Structure for EMC Noise
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Solution Overview
Problem
Power conversion devices in hybrid and electric vehicles face challenges with heat generation and electromagnetic noise due to high voltage and large currents, leading to part deterioration and the need for efficient cooling and noise suppression.
Innovation Solution
A power conversion device design that includes a power semiconductor module, a first capacitor for smoothing power, a conductor section forming power paths, a noise filter section with a second capacitor for high-frequency power smoothing, and a cooling section, where the noise filter section is connected to the conductor section and arranged in a space between the cooling surface and the noise filter section to enhance heat dissipation and impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a noise filter circuit is added to suppress EMC noise, then electromagnetic noise suppression is improved, but impedance of power path increases causing higher power loss and heat generation
Solution Approach 1:
The patent introduces a third-dimensional cooling structure (water channel with cooling surface) to manage the heat generated by the noise filter. This spatial arrangement allows the conductor section to be positioned between the cooling surface and noise filter, creating a thermal management pathway that resolves the contradiction by providing heat dissipation capacity without changing the electrical filter configuration.
2Object-affected harmful factors
If a noise filter circuit is added to suppress EMC noise, then electromagnetic noise suppression is improved, but heat generation increases requiring efficient cooling
Solution Approach 1:
The cooling surface acts as an intermediary thermal management component between the heat-generating noise filter and the conductor section. The water channel system serves as a mediator to transfer heat away from critical components, allowing the noise filter to function effectively without excessive temperature rise.
3Object-affected harmful factors
If wiring cross-sectional area is reduced to manage impedance, then noise filter performance is improved, but power loss and heat generation increase
Solution Approach 1:
The patent converts the harmful heat generated by the reduced cross-sectional area wiring into a manageable thermal parameter by introducing an active cooling system. The water channel transforms the previously problematic heat into a controlled thermal flow that can be dissipated efficiently, allowing the narrow wiring to maintain both low impedance and acceptable temperature levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the reliability of the power conversion device by reducing heat generation and enhancing noise filter performance through efficient cooling and impedance management, thereby extending the lifespan of components and maintaining high output.
Implementation Method 1
a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section
Data Source
AI summary
To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.


