Power Conversion Device Integrated Cooling Housing

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Solution Overview

Problem

The existing forced-air cooling type vehicular power conversion devices have a complex configuration due to separate semiconductor, blower, and air channel chambers, leading to increased size, component count, and assembly complexity.

Innovation Solution

A power conversion device with a housing divided into a closed section for electronic components and an open section for heat dissipation, where a blower unit is adjacent to the heat sink unit, creating a flow path for air to pass through and cool the reactor unit, simplifying the structure while maintaining cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If separate semiconductor chamber, blower chamber, and air channel are arranged, then cooling performance is improved, but device complexity and size increase

Engineering Contradiction:
Improvecooling performanceVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the semiconductor chamber, blower chamber, and air channel into a single integrated housing structure. The housing internally forms these functional zones without requiring separate external chambers, thereby maintaining effective cooling performance while reducing overall device complexity and size.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The blower is positioned within the housing such that its impeller extends through a partition wall into the semiconductor chamber space. This nested arrangement allows the blower to serve dual purposes: housed in its own space while directly accessing the semiconductor chamber for air circulation, eliminating the need for separate blower and semiconductor chambers.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Temperature

If separate semiconductor chamber, blower chamber, and air channel are arranged, then cooling performance is improved, but number of components increases

Engineering Contradiction:
Improvecooling performanceVSAvoidnumber of components
Core Design Contradiction:
TemperatureVSQuantity of substance

Solution Approach 1:

Multiple functional chambers (semiconductor chamber, blower chamber, air channel) are merged into a single housing structure, reducing the number of discrete components while preserving all necessary cooling functions through internal spatial organization.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing serves multiple functions simultaneously: it provides structural enclosure, creates separate functional zones for semiconductors and blower, and forms air channels for cooling. This multi-functionality reduces the need for additional dedicated components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If separate semiconductor chamber, blower chamber, and air channel are arranged, then cooling performance is improved, but assembly work complexity increases

Engineering Contradiction:
Improvecooling performanceVSAvoidassembly complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

By integrating the semiconductor chamber, blower chamber, and air channel into a single housing, the number of assembly operations is reduced. Workers assemble one integrated housing unit rather than multiple separate chambers, significantly simplifying assembly work while maintaining effective cooling performance.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration simplifies the power conversion device structure while maintaining effective cooling performance by arranging the blower and heat sink units in a way that air flows through the device, reducing the number of components and assembly complexity.

Implementation Method 1

a heat sink exposed to the outside air to release heat transferred from the electronic components

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Implementation Method 2

release heat transferred from the electronic components through the open section to the outside air

Methodology Applied
Scientific EffectThermal convection: Convection

Implementation Method 3

a blower having an impeller at least partially exposed to the second space from the opening, the blower blowing air from the second space toward the first space

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 4

fins or a spike-array-shaped heat sink is formed for dissipation of heat transferred from the semiconductor elements

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3493388B1Power conversion device
Publication Date: 2022.01.12 MITSUBISHI ELECTRIC CORP
  • EP3493388B1 patent drawingFigure 1
  • EP3493388B1 patent drawingFigure 2~3
  • EP3493388B1 patent drawingFigure 4~5

AI summary

Electronic components included in a power conversion unit are housed in a closed section (10a) of a first unit (10), and the first unit (10) includes a heat sink exposed to an open section (10b) and releases heat transferred from the electronic components. A blower is housed in a first space (20a) of a second unit (20), and at least a portion of an impeller of the blower is exposed to a second space (20b) from an opening (22). A reactor is housed in a third unit (30). Outside air flows through a flow inlet (13) into an interior of the power conversion device (1), passes through the open section (10b), a first vent (14), the second space (20b), the opening (22), the first space (20a), a second vent (23), and the third unit (30), and then is discharged to the exterior of the power conversion device (1) from a flow outlet (31).